Piezoelectric Trackpad Haptic Structure With Integrated PCB Support
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Solution Overview
Problem
Existing haptic devices face challenges in providing efficient haptic effects and robust mechanical connections for touch-based user interfaces, such as laptop trackpads, due to limitations in damping and energy transfer mechanisms, which affect the reliability and manufacturing efficiency of piezoelectric transducers.
Innovation Solution
A haptic device design featuring a substrate layer with depressions, a touch-interface surface, and piezoelectric transducers supported by a carrier structure and adhesive elements, with electrical coupling via conductive traces and PCB layers, enhancing mechanical robustness and manufacturing efficiency while improving signal routing and touch detection capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If piezoelectric transducers are used to provide haptic effects in touch-based user interfaces, then tactile sensation can be provided to users, but the device structure becomes complex and manufacturing reliability is compromised due to challenges in mechanical and electrical connections
Solution Approach 1:
The patent merges the mechanical support function and electrical connection function into a single integrated PCB layer. The PCB serves both as the structural carrier for the piezoelectric element and as the electrical pathway for signal transmission, eliminating the need for separate mechanical supports and reducing connection points that could fail.
Solution Approach 2:
The PCB layer is designed to perform multiple functions simultaneously: it provides mechanical support for the piezoelectric element, establishes electrical connections through conductive traces, and serves as part of the haptic actuation structure. This multi-functionality reduces overall device complexity while maintaining reliability.
2Productivity
If traditional haptic device designs are used, then haptic effects can be provided, but the device thickness increases and manufacturing efficiency is reduced
Solution Approach 1:
The patent extracts the mechanical support function from a separate component and integrates it directly into the PCB layer. By removing the need for additional mechanical support structures, the device thickness is reduced and the number of assembly steps is minimized, thereby improving manufacturing efficiency.
Solution Approach 2:
The invention transitions from a multi-layer stacked architecture to a planar integration approach where the PCB layer serves multiple functions in a single plane. This dimensional reorganization reduces the overall device thickness while maintaining structural integrity and electrical connectivity.
3Reliability
If piezoelectric elements are mechanically supported by separate structures, then mechanical stability is achieved, but the transfer of haptic effects to the touch-interface surface becomes less efficient
Solution Approach 1:
The PCB layer is designed to directly contact and support the piezoelectric element while serving as the structural framework. This merging of support and signal transmission functions creates a rigid mechanical pathway that efficiently transfers haptic energy from the piezoelectric element to the touch-interface surface without energy loss through intermediate joints or interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more efficient transfer of haptic effects, improved robustness, and reduced manufacturing complexity, allowing for thinner and more sensitive haptic devices with enhanced touch sensitivity and reduced connector needs.
Implementation Method 1
at least one piezoelectric transducer on the second side of the substrate layer comprising a support plate and a piezoelectric element
Data Source
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AI summary
A device comprises a substrate layer having a first side and a second side. The second side of the substrate layer comprises at least one depression. The device further comprises a touch-interface surface on the first side of the substrate layer. The device comprises at least one piezoelectric transducer on the second side of the substrate layer comprising a support plate and a piezoelectric element. The at least one piezoelectric transducer is aligned with the at least one depression of the substrate layer. The device further comprises a printed circuit board, PCB, layer electrically coupled to the piezoelectric element of the piezoelectric transducer. The device can be used as a trackpad.