Piezoelectric Ultrasonic Transducer Mechanical Compression Assembly
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Solution Overview
Problem
Traditional ultrasonic transducer devices fail to maintain intimate contact between the piezoelectric element and the delay block at high temperatures, and most adhesive/couplant compounds used are not radiation-resistant.
Innovation Solution
A radiation and high-temperature tolerant piezoelectric ultrasonic contact transducer with a screw-in assembly, featuring stainless steel and ceramic material parts, which ensures both radiation resistance and effective mechanical and electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive/couplant compounds are used to maintain contact between piezoelectric element and delay block, then intimate contact is achieved, but the adhesive deteriorates at high temperatures and fails in radiation environments
Solution Approach 1:
The patent removes the adhesive/couplant compound from the system entirely. Instead of using a chemical bonding agent that fails at high temperatures and in radiation, the design employs a mechanical compression assembly that maintains intimate contact through pure mechanical force, eliminating the vulnerable adhesive component.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical bonding mechanism (compression assembly). The mechanical system uses a compression member that applies continuous force to maintain contact between the piezoelectric element and delay block, substituting chemical adhesion with mechanical compression that is tolerant of high temperatures and radiation.
2Reliability
If adhesive/couplant compounds are used to attach piezoelectric element, then mechanical contact is achieved, but the compound fails in radiation environments
Solution Approach 1:
The patent extracts and removes the radiation-vulnerable adhesive/couplant compound from the assembly. The mechanical contact is achieved through direct compression of solid components (piezoelectric element against delay block) maintained by a compression member, eliminating any organic or chemical bonding agents that would degrade under radiation exposure.
Solution Approach 2:
The patent substitutes chemical adhesion (adhesive/couplant) with mechanical compression. The compression member applies continuous mechanical force to ensure intimate contact between components, replacing the chemical bonding system with a purely mechanical system that is inherently more resistant to radiation damage.
3Duration of action of moving object
If traditional transducer design is used, then manufacturing simplicity is maintained, but operational life in harsh environments is limited
Solution Approach 1:
The patent divides the transducer into distinct functional segments: a piezoelectric element, a delay block, and a separate compression member. This segmentation allows each component to be optimized for its specific function and replaced independently if needed, enhancing operational life in harsh environments while maintaining manageable assembly complexity through modular design.
Solution Approach 2:
The patent changes the fundamental parameter of bonding from chemical adhesion to mechanical compression. This parameter change enables the use of materials and structures that are tolerant of high temperatures and radiation, significantly extending operational life in harsh environments, while the compression-based approach actually simplifies the assembly process by eliminating adhesive curing steps and alignment requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The transducer maintains operational integrity and effectively transmits and receives acoustic and ultrasonic waves in harsh environments, including high temperatures and radiation, with a long operational life.
Implementation Method 1
A piezoelectric element can be attached to the bottom of the backing and can be pushed out of the cylindrical opening using a pressure screw, making both electrical and mechanical contact with a delay line structure
Implementation Method 2
acts as emitter, receiver or transceiver of acoustic or ultrasonic waves that propagate in solids and fluids
Data Source
AI summary
The embodiments disclose an ultrasonic transducer that can require a piezoelectric element attached to the transducer to be constantly under high pressure, and this required pressure can be provided and maintained by the transducer's design at all temperatures during its operation. The exemplary ultrasonic transducer can eliminate a failure of the bond between the piezoelectric element and a delay block by using the mechanical structure to hold all components in place while permitting the piezoelectric transducer to generate pulses of the desired frequency, frequency bandwidth, and pulse width without undesired echoes and/or attenuations.