Piezoelectric Acoustic Transducer Slit Structure for Higher Sound Pressure

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Solution Overview

Problem

Existing piezoelectric acoustic transducers face challenges in achieving high sound pressure and efficient sound production.

Innovation Solution

A piezoelectric acoustic transducer design featuring a piezoelectric element section, diaphragm, support section, and elastic film, with a slit dividing the elements into regions, and an elastic film covering the slit opening, along with a specific manufacturing method involving laminated film formation, slit creation, and selective removal of substrate layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stress or pressure

If a piezoelectric element section and diaphragm are divided into multiple regions using a slit, then sound pressure is increased, but device complexity increases due to the need for elastic film coverage and manufacturing precision

Engineering Contradiction:

Improvesound pressureVSAvoiddevice complexity

Core Design Contradiction:

Stress or pressureVSDevice complexity

Solution Approach 1:

The piezoelectric element section and diaphragm are divided into multiple regions by introducing a slit that extends from the first surface through to the second surface. This segmentation allows different regions to vibrate independently, increasing sound pressure output while managing the complexity through systematic division of the structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An elastic film is introduced as an intermediary component to cover the opening of the slit on the piezoelectric element side. This elastic film acts as a mediator that seals the slit opening while allowing vibration transmission, thereby maintaining the sound pressure enhancement effect without compromising structural integrity or causing leakage.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stress or pressure

If a slit is formed through multiple layers including piezoelectric film and conductive films, then sound pressure is enhanced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvesound pressureVSAvoidmanufacturing precision

Core Design Contradiction:

Stress or pressureVSManufacturing precision

Solution Approach 1:

The slit is formed in a predetermined pattern through the piezoelectric film and conductive films before final assembly. By planning and creating the slit structure in advance during the manufacturing process, the precision requirements are managed through systematic fabrication steps rather than post-processing adjustments.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The elastic film is embedded within the slit structure, creating a nested configuration where the elastic film is positioned inside the slit opening. This nesting approach allows the elastic film to be integrated into the multi-layer structure without requiring separate precision alignment steps, thereby reducing overall manufacturing precision requirements.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Stress or pressure

If elastic film is embedded in the slit from the first surface side, then sound pressure is increased, but the manufacturing process becomes more complex with multiple removal steps

Engineering Contradiction:

Improvesound pressureVSAvoidease of manufacture

Core Design Contradiction:

Stress or pressureVSEase of manufacture

Solution Approach 1:

The elastic film is embedded in the slit from the first surface side during an intermediate manufacturing step, before the final removal of support structures. This preliminary embedding ensures proper positioning and integration of the elastic film, and the subsequent removal steps are designed to selectively remove only the support layer and buried insulating layer while preserving the elastic film in the slit.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The support layer and buried insulating layer are selectively removed from the second surface side in a predetermined range, while the elastic film embedded in the slit is preserved. This selective removal process discards the unnecessary support structures while recovering and retaining the elastic film that is essential for maintaining the slit opening and enhancing sound pressure.

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances sound pressure and reduces total harmonic distortion, improving the sound production efficiency of the transducer.

Implementation Method 1

a piezoelectric element section having a piezoelectric film disposed between a pair of electrodes

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

elastic film is provided so as to cover an opening of the slit on the piezoelectric element side

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20250211917A1Piezoelectric acoustic transducer, manufacturing method of piezoelectric acoustic transducer

Publication Date: 2025.06.26 STANLEY ELECTRIC CO LTD

AI summary

A piezoelectric acoustic transducer including: a piezoelectric element section having a piezoelectric film disposed between a pair of electrodes; a diaphragm disposed on a first surface side of the piezoelectric element section; a support section supporting the peripheral portion of the diaphragm; and an elastic film disposed on a second surface side of the piezoelectric element section, where the piezoelectric element section and the diaphragm have a slit dividing the piezoelectric element section and the diaphragm into a plurality of regions, and where elastic film is provided so as to cover an opening of the slit on the piezoelectric element side.