Piezoelectric Vibration Assembly With Modulus-Matched Adhesive Support
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Solution Overview
Problem
Piezoelectric-type vibration apparatuses are prone to damage from external impacts, leading to low reliability in sound reproduction and poor sound characteristics, especially in low-pitched sound bands due to their fragile nature and low piezoelectric constants.
Innovation Solution
A vibration apparatus is designed with a vibration device and an adhesive member where the modulus of the vibration device is equal to or greater than the modulus of the adhesive member, enhancing the reliability of sound reproduction and sound pressure level characteristics in low-pitched sound bands by providing additional support and improved adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a piezoelectric-type vibration apparatus is used, then the device structure is compact and simple, but the reliability of sound reproduction is low due to fragility and low piezoelectric constants
Solution Approach 1:
The patent uses a composite structure consisting of a piezoelectric device and a vibration device with different moduli. The vibration device acts as a supporting structure that compensates for the fragility of the piezoelectric element, creating a composite system that maintains compactness while improving reliability through the synergistic combination of materials with different mechanical properties.
Solution Approach 2:
The vibration device serves as an intermediary between the piezoelectric device and the external environment. It transfers and amplifies the vibrations generated by the piezoelectric element while providing mechanical support and protection, thereby enhancing sound reproduction reliability without compromising the compact structure.
2Device complexity
If a piezoelectric-type vibration apparatus is used, then the device is compact, but the sound characteristic and sound pressure level in low-pitched sound band are poor
Solution Approach 1:
The patent changes the mechanical parameters of the system by introducing a vibration device with specific modulus relationships (greater than or equal to the piezoelectric device). This parameter change enables the system to effectively generate low-pitched sounds while maintaining the compact piezoelectric structure, improving sound characteristics without increasing device complexity.
3Reliability
If the modulus of the vibration device is greater than or equal to the modulus of the adhesive member, then the reliability of sound reproduction is enhanced, but the device requires additional material properties control
Solution Approach 1:
The patent establishes a specific parameter relationship (modulus of vibration device ≥ modulus of adhesive member) that optimizes the mechanical coupling between components. This parameter control ensures reliable sound reproduction while providing clear manufacturing guidelines that make the requirement manageable through standard material selection and quality control procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of sound reproduction and improves sound characteristics and sound pressure level in low-pitched sound bands, achieving a sound pressure level of 55 dB to 91 dB in the specified frequency range with improved flatness.
Implementation Method 1
Piezoelectric-type vibration apparatuses may be easily damaged by an external impact due to a fragile characteristic of a piezoelectric device
Implementation Method 2
an adhesive member at a surface of the vibration device
Data Source
AI summary
A vibration apparatus may include a vibration device and an adhesive member at a surface of the vibration device. A modulus of the vibration device may be equal to a modulus of the adhesive member or may be greater than the modulus of the adhesive member.