Piezoelectric Vibration Apparatus Solderless Cable Integration
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Solution Overview
Problem
Existing vibration apparatuses with piezoelectric elements face challenges in manufacturing complexity and cost due to the need for soldering processes, which can lead to disconnection issues under vibrational stress.
Innovation Solution
A vibration apparatus with a simplified structure and manufacturing process, featuring a first and second cover member, a vibration portion between them, a contact portion, and a signal cable with dual signal lines connected to opposite surfaces of the vibration portion, eliminating the need for soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering process is used to connect pad electrode to signal cable, then electrical connection is achieved, but manufacturing complexity and cost increase, and connection reliability decreases under vibrational stress
Solution Approach 1:
The patent replaces the mechanical soldering process with a direct mechanical connection structure. The signal cable is integrated into the film actuator structure, eliminating the need for separate soldering operations and reducing manufacturing complexity while improving connection reliability under vibration.
Solution Approach 2:
The patent merges the signal cable integration with the film actuator manufacturing process. The signal cable is incorporated during the film assembly process rather than being added separately through soldering, thereby simplifying manufacturing and reducing the number of process steps.
2Length of stationary object
If traditional solder bonding is used for connecting elements, then electrical connection is established, but the structure becomes thicker and more complex
Solution Approach 1:
The patent extracts and eliminates the solder bonding layer from the structure. By directly integrating the signal cable into the film actuator, the thick solder layer is removed, thereby reducing the overall apparatus thickness and simplifying the manufacturing process.
3Length of stationary object
If piezoelectric elements are used to achieve thin thickness, then device slimming is achieved, but manufacturing complexity increases due to additional connection processes
Solution Approach 1:
The patent combines the signal cable integration with the piezoelectric element mounting process. The signal cable is routed and secured during the same manufacturing sequence as the piezoelectric element installation, eliminating the need for separate soldering steps and reducing overall manufacturing complexity despite using thin piezoelectric elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the secure adhesion of the vibrating portion to the signal cable, reduces the apparatus thickness, extends its lifespan, improves sound output and quality, and simplifies the manufacturing process while minimizing sound characteristic reductions even with high surface resistance electrodes.
Implementation Method 1
piezoelectric elements capable of realizing a thin thickness are attracting much attention
Data Source
AI summary
A vibration apparatus can include a first cover member; a second cover member; a vibration portion between the first cover member and the second cover member; a contact portion between the first cover member and the vibration portion; and a signal cable. The signal cable can include a first signal line connected to a first surface of the vibration portion via the contact portion, and a second signal line connected to a second surface of the vibration portion opposite to the first surface of the vibration portion.