Piezoelectric Vibration Apparatus With Dual-Modulus Impact Cushioning
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Solution Overview
Problem
Piezoelectric-type vibration apparatuses are prone to damage from external impacts due to their fragile nature, have low sound pressure levels in low-pitched sounds, and exhibit high sound pressure level flatness in the reproduction frequency band.
Innovation Solution
A vibration apparatus with a vibration plate connected by a connection member comprising a first connection member overlapping the vibration structure and a second connection member surrounding it, where the first connection member has a higher elastic modulus than the second, enhancing sound pressure levels and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a piezoelectric device is used for vibration, then the device can generate sound, but the device becomes fragile and prone to damage from external impacts
Solution Approach 1:
The patent applies beforehand cushioning by introducing a rubber layer between the piezoelectric device and the vibration plate. This rubber layer acts as a cushion that absorbs external impacts before they reach the fragile piezoelectric device, preventing damage while allowing the device to function normally during operation.
Solution Approach 2:
The patent uses an intermediary approach by placing a rubber layer as a mediator between the piezoelectric device and the vibration plate. This intermediary layer protects the piezoelectric device from direct impact while still allowing effective vibration transmission during normal operation.
2Power
If a piezoelectric device is used for vibration, then the device can operate, but the sound pressure level is low in low-pitched sound bands
Solution Approach 1:
The patent applies parameter changes by modifying the mechanical properties of the connection between the piezoelectric device and vibration plate. By using a rubber layer with specific elastic modulus characteristics, the system changes the mechanical coupling parameters to enhance low-frequency vibration transmission, thereby improving sound pressure level in low-pitched bands.
Solution Approach 2:
The patent uses composite materials by combining the piezoelectric device with a rubber layer having different mechanical properties. This composite structure leverages the piezoelectric effect for actuation while the rubber material enhances low-frequency vibration transmission characteristics.
3Power
If a piezoelectric device is used for vibration, then the device can generate sound, but the sound pressure level flatness is high in the reproduction frequency band
Solution Approach 1:
The patent applies parameter changes by adjusting the elastic modulus of the rubber layer to optimize the mechanical coupling across different frequency ranges. This parameter optimization helps flatten the sound pressure level response across the reproduction frequency band.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves enhanced sound pressure levels and flexibility, particularly in middle-pitched and low-pitched sound bands, by increasing the amplitude displacement of the vibration plate.
Implementation Method 1
piezoelectric-type vibration apparatuses may be easily damaged by an external impact due to a fragile characteristic of a piezoelectric device
Implementation Method 2
a connection member between the vibration plate and the vibration generator, the connection member includes a first connection member disposed between the vibration plate and the vibration structure overlapping the vibration structure and a second connection member surrounding the first connection member and not overlapping the vibration structure, and an elastic modulus of the first connection member is greater than an elastic modulus of the second connection member
Data Source
Figure 1~2
Figure 3A
Figure 3B
AI summary
A vibration apparatus comprises a vibration plate, a vibration generator at the vibration plate and including a vibration structure, and a connection member between the vibration plate and the vibration generator. The connection member includes a first connection member between the vibration plate and the vibration structure and overlapping the vibration structure and a second connection member surrounding the first connection member. A modulus of the first connection member is greater than a modulus of the second connection member.