Piezoelectric Vibration Module With Segmented Soft Circuit Board
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Solution Overview
Problem
In piezoelectric vibration modules and haptic feedback systems, the entire surface bonding of piezoelectric components with a soft circuit board can lead to interference among components, affecting their performance and feedback effects, necessitating a solution to maintain operational independence.
Innovation Solution
A soft circuit board with rectangular or arcuate cut-through grooves is designed to accommodate each piezoelectric unit, reducing interference and allowing for independent vibration, with each unit positioned below cutting areas and connected through specific electrode areas and grooves to prevent cross-talk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the whole surface of the soft circuit board is bonded with vibration components, then the coverage area is maximized, but the operation of vibration components is subject to interference from non-corresponding areas
Solution Approach 1:
The soft circuit board is segmented into multiple independent regions through cut through grooves, creating isolated bonding areas for each piezoelectric vibration component. This segmentation prevents vibrational interference between adjacent components while maintaining comprehensive coverage of the circuit board surface.
2Quantity of substance
If the whole surface of the soft circuit board is bonded with piezoelectric components, then the device density is increased, but the operation of one component may drive other areas to vibrate, causing interference
Solution Approach 1:
The circuit board is divided into discrete bonding areas separated by cut through grooves, allowing multiple piezoelectric components to be densely packed while preventing cross-talk vibration. Each component operates independently within its own isolated region.
Solution Approach 2:
The harmful vibrational interference is extracted and removed from the system by introducing cut through grooves that isolate each piezoelectric component's vibration to its specific bonding area, preventing the propagation of unwanted vibrations to other components.
3Reliability
If cut through grooves are introduced to isolate piezoelectric units, then operational independence is improved, but the structural complexity of the soft circuit board increases
Solution Approach 1:
The soft circuit board is segmented into multiple independent bonding areas through cut through grooves, ensuring that each piezoelectric unit operates independently without interference from adjacent units. This segmentation enhances reliability by isolating operational failures and improving operational independence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures independent operation of each piezoelectric unit, reducing interference and maintaining operational independence, enhancing the performance and feedback quality of both vibration and haptic modules by allowing each unit to vibrate independently without interference, with resonance frequencies optimized for human perception.
Implementation Method 1
a piezoelectric vibration module and haptic feedback module including a soft circuit board with a rectangular or arcuate cut through groove to reduce interference between each of the piezoelectric units
Data Source
AI summary
A piezoelectric vibration module has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board includes a plurality of cutting areas. Two adjacent cutting areas are spaced with a cut through groove. Each piezoelectric unit is respectively configured below each cutting area.