Piezoelectric Microactuator Wrap-Around Electrode Assembly
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Solution Overview
Problem
The existing methods for bonding piezoelectric microactuators (PZTs) to disk drive suspensions are cumbersome, requiring multiple epoxy bonding steps and curing processes, which are difficult to control and time-consuming, and can lead to contamination and increased manufacturing costs.
Innovation Solution
The use of adhesive films and partially curing (B-staging) of adhesives, along with the implementation of wrap-around electrodes on PZTs, simplifies the assembly process by reducing the number of epoxy steps and curing processes, and eliminates the need for liquid epoxy in the final assembly area, enhancing control and reducing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple epoxy bonding steps and curing processes are used to bond PZTs to suspensions, then reliable mechanical and electrical connections are achieved, but the assembly process becomes cumbersome, time-consuming, and difficult to control
Solution Approach 1:
The patent combines multiple separate epoxy bonding steps and curing processes into a single integrated adhesive application step. The adhesive film is applied once to the PZT, simultaneously providing both mechanical bonding and electrical connection functions, eliminating the need for sequential epoxy applications and multiple curing cycles, thus improving assembly efficiency while maintaining bonding reliability
Solution Approach 2:
The adhesive is applied to the PZT in advance during the PZT preparation stage, before the PZT is mounted onto the suspension. This preliminary action allows the adhesive to be positioned precisely on the PZT surface, and the PZT to be stored with the adhesive already in place, ready for immediate assembly, thereby streamlining the overall manufacturing process
2Ease of manufacture
If liquid epoxy is used for bonding PZTs, then flexible adhesive application is possible, but contamination risks increase and manufacturing costs increase
Solution Approach 1:
The patent replaces liquid epoxy with an adhesive film that is applied to the PZT. The adhesive film provides the necessary adhesive properties while eliminating the contamination risks associated with liquid epoxy. The film form factor allows for clean, controlled application and eliminates spills and messy handling issues
Solution Approach 2:
The adhesive film is applied to the PZT during manufacturing and then consumed during the assembly process, leaving no residual liquid material that could cause contamination. This disposable approach to adhesive application eliminates the need for cleanup and reduces contamination risks in the manufacturing environment
3Reliability
If traditional bonding methods are used, then electrical connections can be made, but the number of epoxy steps and curing processes increases manufacturing time and costs
Solution Approach 1:
The adhesive film integrates both mechanical bonding and electrical connection functions into a single material layer. This eliminates the need for separate conductive epoxy steps and multiple curing processes, reducing manufacturing cycle time while maintaining reliable electrical connections between the PZT and suspension
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly process, reduces manufacturing time and costs, and improves the predictability and repeatability of the adhesive application, while maintaining the mechanical and electrical performance of the suspension.
Implementation Method 1
A piezoelectric element or component, made of piezoelectric material, sometimes referred to simply as a PZT, is often used as the microactuator motor
Implementation Method 2
The use of adhesive films and partially curing (B-staging) of adhesives, along with the implementation of wrap-around electrodes on PZTs, simplifies the assembly process
Data Source
AI summary
A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.