Piezoelectric Microactuator Wrap-around Electrode Bonding
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Solution Overview
Problem
The existing methods for bonding piezoelectric microactuators (PZTs) to disk drive suspensions are inefficient, requiring multiple epoxy dispensing and curing steps, which are difficult to control, time-consuming, and costly, and can lead to contamination and performance issues due to the use of liquid adhesives in sensitive areas.
Innovation Solution
The use of adhesive films and partially curing (B-staging) of adhesives, along with the implementation of wrap-around electrodes on PZTs, simplifies the assembly process by eliminating the need for multiple epoxy steps and reducing contamination risks, allowing for precise control of adhesive thickness and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple epoxy dispensing and curing steps are used to bond PZTs to suspensions, then bonding reliability is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent combines multiple separate epoxy dispensing and curing steps into a single integrated adhesive dispensing step. The adhesive composition contains both non-conductive adhesive and conductive adhesive components that are dispensed simultaneously, eliminating the need for sequential operations and reducing manufacturing complexity while maintaining bonding reliability.
Solution Approach 2:
The adhesive composition serves multiple functions simultaneously: it provides mechanical bonding (non-conductive adhesive function), electrical connection (conductive adhesive function), and gap filling. This multi-functional adhesive replaces the need for separate bonding and electrical connection steps, simplifying the manufacturing process.
2Strength
If multiple epoxy dispensing and curing steps are used, then bonding strength is improved, but assembly time increases
Solution Approach 1:
The patent merges multiple curing steps into a single curing operation. By formulating an adhesive that contains both non-conductive and conductive components in one dispensable mixture, the patent eliminates the time required for multiple sequential dispensing and curing cycles, reducing assembly time while maintaining bonding strength.
Solution Approach 2:
The adhesive composition is pre-formulated to contain all necessary components (non-conductive adhesive, conductive adhesive, and fillers) in the correct proportions before dispensing. This preliminary preparation allows for single-step application and curing, eliminating the need for multiple preparation and application steps during assembly.
3Adaptability or versatility
If liquid adhesives are used in sensitive areas, then bonding flexibility is improved, but contamination risk increases
Solution Approach 1:
The patent employs a viscous adhesive composition that behaves like a controlled film or paste rather than a free-flowing liquid. The adhesive has sufficient viscosity to remain in place during assembly, providing bonding flexibility similar to liquid adhesives while minimizing the risk of contamination by preventing adhesive migration to sensitive areas.
Solution Approach 2:
The patent modifies the physical parameters of the adhesive by adjusting its viscosity and incorporating fillers. These parameter changes transform the adhesive from a low-viscosity liquid that can migrate and contaminate into a viscous composition that maintains its position while still providing effective bonding, thus reducing contamination risk.
4Manufacturing precision
If adhesive films and B-staging are used, then manufacturing precision is improved, but process complexity increases
Solution Approach 1:
The patent achieves precise adhesive thickness control by formulating the adhesive with specific viscosity characteristics and incorporating rigid fillers. These parameter changes allow the adhesive to maintain a consistent thickness profile during dispensing and curing without requiring the B-staging process, thereby achieving manufacturing precision while avoiding the added process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly process, reduces contamination, and improves the predictability and repeatability of the bonding process, leading to more reliable and efficient manufacturing of dual-stage actuated disk drive suspensions with reduced assembly time and costs.
Implementation Method 1
The adhesive is configured to bond the piezoelectric microactuator to the suspension
Implementation Method 2
the conductive material extending to and being in electrical contact with the first and second side electrodes
Data Source
AI summary
A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.