Pillar-Shaped Component Plating with Ring-Like Projection
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Solution Overview
Problem
Existing semiconductor devices with pillar-shaped components, such as post electrodes, often experience a high frequency of defective components due to internal stress and mechanical weakness, leading to issues like post electrodes falling out or breaking, caused by projection parts or step-like features at joint positions between copper layers.
Innovation Solution
The device incorporates pillar-shaped components with a first and second pillar-shaped part formed by plating, along with a ring-like projection part on the lateral face that projects outward and extends in a circumferential direction, positioned higher than the joint between the first and second pillar-shaped parts, reducing the occurrence of defective components by enhancing mechanical strength and preventing adhesion issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If multiple copper layers are stacked to form post electrodes, then the height and electrical conductivity are improved, but the mechanical strength and adhesion at joint positions deteriorate due to internal stress and projection parts
Solution Approach 1:
The patent applies composite materials by stacking multiple copper layers with different orientations (first Cu layer with first orientation, second Cu layer with second orientation different from first) to form a post electrode. This composite structure improves both height and electrical conductivity while the specific orientation arrangement helps manage internal stress to maintain adhesion strength at joint positions.
2Ease of manufacture
If temporary seal layers are applied between copper layers, then the manufacturing process is simplified, but ring-like projection parts are formed at boundary positions causing defects
Solution Approach 1:
The patent removes the temporary seal layer formation step from the manufacturing process. Instead of applying temporary seal layers between copper layers and then removing them, the invention directly forms subsequent copper layers on the plated copper surface, eliminating the source of ring-like projection parts and associated manufacturing defects.
3Manufacturing precision
If CMP is applied to each copper layer, then the surface flatness is improved, but the manufacturing complexity and time increase
Solution Approach 1:
The patent merges the surface flatness control function into a single CMP step performed after forming the second Cu layer, rather than applying CMP to each copper layer separately. This combined approach maintains the necessary surface flatness for subsequent processing while reducing manufacturing complexity and processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the frequency of defective pillar-shaped components by preventing weak adhesion and falling out, while allowing for sufficient height and reliability of post electrodes even with inexpensive plating apparatuses, thus improving the manufacturing process and product reliability.
Implementation Method 1
a first pillar-shaped part formed by plating, a second pillar-shaped part formed on the first pillar-shaped part by plating
Data Source
AI summary
A device with pillar-shaped components, includes a substrate; a wiring layer disposed on the substrate; and pillar-shaped components disposed on any of the substrate and the wiring layer, each of the pillar-shaped components having a bottom part connected to the substrate and/or the wiring layer, a top part opposed to the bottom part, and a lateral face part extending from the bottom part and connected to the top part; wherein each of the pillar-shaped components includes a first pillar-shaped part formed by plating, a second pillar-shaped part formed on the first pillar-shaped part by plating, and a ring-like projection part formed on the lateral face part to project outward and extend in a circumferential direction, and to be in a position higher than a joint position between the first pillar-shaped part and the second pillar-shaped part.