Conductive Pillar Segmentation for Semiconductor Package Yield
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Solution Overview
Problem
The manufacturing process of tall conductive pillars in semiconductor device packages is prone to damage, and the existing methods require all manufacturing steps to succeed, leading to high costs and reduced yield rates due to the need for precise formation and protection of these pillars.
Innovation Solution
The solution involves forming separate conductive pillars on a conductive layer and a circuit layer, connecting them through a conductive adhesion, and encapsulating them within a package body, eliminating the need for a single tall pillar formation and reducing the risk of damage during grinding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single tall conductive pillar is formed to achieve electrical connection, then the electrical connection function is satisfied, but the manufacturing complexity and risk of damage increase
Solution Approach 1:
The patent divides a single tall conductive pillar into multiple shorter conductive pillars arranged in an array. Each pillar is independently formed through electroplating, and they collectively provide the electrical connection function. This segmentation reduces the height requirement for each individual pillar, lowering manufacturing complexity and damage risk while maintaining overall connectivity.
Solution Approach 2:
Multiple conductive pillars are merged into a single functional unit that performs the electrical connection. The pillars are arranged in an array and electrically connected through the molding compound, effectively combining their individual conductive paths into a unified connection system that satisfies the electrical requirements.
2Reliability
If a molding compound is formed to fully cover the conductive pillars for protection, then the conductive pillars are protected, but the manufacturing cost increases and yield rate decreases due to the need for precise formation
Solution Approach 1:
The conductive pillars are formed in advance through electroplating before the molding compound is applied. This preliminary formation ensures that the pillars are already in place and properly positioned, allowing the molding compound to simply cover and protect them without requiring precise alignment or formation steps, thereby increasing yield rate.
3Reliability
If all manufacturing steps must succeed for the package to be functional, then the product quality is ensured, but the manufacturing cost increases and yield rate decreases
Solution Approach 1:
The manufacturing process is segmented into independent steps: forming the conductive pillar array through electroplating, applying the molding compound for protection, and adding the conductive cap. Each step can be independently optimized and controlled, allowing partial failures to be corrected without scrapping the entire package, thus reducing cost and improving yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures the integrity of conductive pillars and increases the yield rate by allowing separate formation and connection of pillars, reducing manufacturing complexity and cost, while ensuring functional components before final assembly.
Implementation Method 1
connecting them through a conductive adhesion
Data Source
AI summary
A semiconductor device package includes a conductive layer, a first conductive pillar, a circuit layer and a second conductive pillar. The conductive layer has a first surface. The first conductive pillar is disposed on the first surface of the conductive layer. The circuit layer is disposed over the conductive layer. The circuit layer has a first surface facing the conductive layer. The second conductive pillar is disposed on the first surface of the circuit layer. The first conductive pillar is physically spaced apart from the second conductive pillar and electrically connected to the second conductive pillar.