Semiconductor Pillar Waveguide Packaging for Low-Loss Fiber Coupling
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller and more creative packaging techniques for semiconductor dies as demand for shrinking electronic devices grows, particularly in integrating waveguide dies for efficient optical signal transmission while maintaining high integration density and reducing optical loss.
Innovation Solution
The process involves fabricating waveguide dies with semiconductor pillar portions embedded in a dielectric layer, where the dielectric layer has a refractive index lower than the semiconductor pillar portions, allowing for total internal reflection and efficient light guidance, and integrating these dies into a package with an insulating encapsulant to reduce optical noise and enhance optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If waveguide dies are integrated into semiconductor packages for optical signal transmission, then optical performance is improved, but device complexity increases
Solution Approach 1:
The patent combines the waveguide die with the semiconductor die in a single package structure, integrating optical signal transmission functionality directly into the electronic device. The waveguide die is positioned in direct contact with the semiconductor die, eliminating the need for separate optical coupling components and reducing overall device complexity while maintaining optical performance.
Solution Approach 2:
The package structure is designed to serve multiple functions simultaneously: the waveguide die provides optical signal transmission, the semiconductor die provides electronic processing, and the encapsulant provides both mechanical protection and optical coupling. This multi-functionality reduces the need for additional dedicated components.
2Productivity
If integration density is increased to meet demand for smaller electronic devices, then productivity is improved, but manufacturing precision requirements worsen
Solution Approach 1:
The patent divides the package into distinct functional segments: the semiconductor die, the waveguide die, and the encapsulant. Each segment can be manufactured and tested independently before final assembly, allowing for standardized manufacturing processes that maintain precision while enabling high integration density through systematic arrangement of multiple such units.
3Loss of energy
If waveguide dies are used for optical signal transmission, then optical loss is reduced, but ease of manufacture worsens
Solution Approach 1:
The waveguide die is designed to provide its own optical coupling functionality through its physical and optical properties. The dielectric material and structural configuration enable total internal reflection and efficient light guidance without requiring additional optical components or complex alignment mechanisms, thereby reducing manufacturing complexity while maintaining low optical loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables lower optical loss and improved optical performance by effectively guiding light between photoelectric integrated circuit dies and optical signal sources, facilitating the integration of more complex electronic components in smaller form factors.
Implementation Method 1
the dielectric layer has a refractive index lower than the semiconductor pillar portions, allowing for total internal reflection and efficient light guidance
Data Source
AI summary
A structure adapted to optical coupled to an optical fiber includes a photoelectric integrated circuit die, an electric integrated circuit die, a waveguide die and an insulating encapsulant. The electric integrated circuit die is over and electrically connected to the photoelectric integrated circuit die. The waveguide die is over and optically coupled to the photoelectric integrated circuit die, wherein the waveguide die includes a plurality of semiconductor pillar portions extending from the optical fiber to the photoelectric integrated circuit die. The insulating encapsulant laterally encapsulates the electric integrated circuit die and the waveguide die.