Semiconductor Package Layout for Direct PIM-to-Logic Connection
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Solution Overview
Problem
Conventional semiconductor architectures face bottlenecks in data movement between memory and logic, particularly in high-performance computing and large-scale parallel operations, leading to inefficiencies and increased power consumption.
Innovation Solution
Implementing a Processing-In-Memory (PIM) die in a package-on-package (POP) structure, where the PIM die is directly connected to the logic die without conductive posts, utilizing a redistribution layer structure to optimize signal transmission paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a conventional POP structure with conductive posts is used to connect memory die and logic die, then electrical connection is established, but data movement latency increases and operation speed decreases
Solution Approach 1:
The patent removes the conductive posts from the signal transmission path between PIM die and logic die. By extracting this intermediate component, the signal can travel directly through the redistribution layer without detouring through conductive posts, thereby reducing data movement latency and improving operation speed.
Solution Approach 2:
The patent segments the package structure into distinct functional layers: the lower package contains the logic die on the first redistribution layer structure, while the upper package contains the PIM die on the second redistribution layer structure. This segmentation allows optimized signal paths for different functions, with direct connection between PIM die and logic die through the redistribution layer without requiring conductive posts.
2Use of energy by moving object
If data is moved between separate memory and logic functions, then von Neumann architecture operates, but power consumption increases due to data movement
Solution Approach 1:
The patent merges memory and processing functions into a single PIM (Processing-In-Memory) die. This combination eliminates the need to move data between separate memory and logic units, thereby reducing both power consumption and data movement time. The PIM die can perform computations directly on stored data without requiring data transfer to external logic units.
3Reliability
If PIM die is connected through conductive posts in conventional POP structure, then electrical connection is established, but signal transmission path is lengthened
Solution Approach 1:
The patent extracts the conductive posts from the signal transmission path. By removing this intermediate connection component, the signal transmission path between PIM die and logic die is shortened, improving signal integrity and reducing transmission delays while maintaining reliable electrical connection through the redistribution layer.
Data Source
AI summary
A semiconductor package including a first redistribution layer structure, a logic die on the first redistribution layer structure, a plurality of conductive posts on the first redistribution layer structure and next to the logic die, a second redistribution layer structure on the logic die, and a processing in memory (PIM) die on the second redistribution layer structure.