Electronic Component Assembly Pin Alignment via Multi-Angle Imaging
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Solution Overview
Problem
In the traditional process of manufacturing printed circuit boards using Through Hole Technology, the lack of high-precision inspection technology for automatic insertion of electronic components leads to inaccurate alignment of pins with holes due to scattered illumination from slender structures and metal surfaces, resulting in distortion of pin distribution images and inefficiencies in automatic through-hole component assembly.
Innovation Solution
An electronic-component assembly system comprising a gripping device, a light-source device, a photographing device, and an image-processing device that generates one-dimensional images of pins at different rotation angles, transforms them into a two-dimensional image, and provides adjustment information to accurately align the components for precise insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional photography with scattered illumination is used to capture pin distribution images, then the imaging process is simple, but the pin distribution image becomes distorted and inaccurate due to scattered light from slender structures and metal surfaces
Solution Approach 1:
The patent transforms the imaging problem from two-dimensional plane photography to three-dimensional spatial mapping. By capturing images at multiple rotation angles and reconstructing the pin distribution in 3D space, the system overcomes the limitation of scattered light in traditional 2D photography and achieves accurate pin position detection despite illumination challenges
Solution Approach 2:
The patent introduces an intermediary computational processing step between light capture and final image formation. The image processing device reconstructs the pin distribution image from multiple rotated views through computational algorithms, acting as an intermediary that transforms scattered light data into accurate pin position information
2Manufacturing precision
If automatic through-hole component assembly is implemented without high-precision inspection technology, then the assembly process is faster, but the alignment accuracy of pins with holes deteriorates
Solution Approach 1:
The patent performs preliminary inspection and measurement of pin distribution before the insertion process. By capturing images at multiple rotation angles and reconstructing the accurate pin positions in advance, the system prepares correction data that enables subsequent high-precision automatic insertion without compromising assembly speed
Solution Approach 2:
The patent implements a feedback mechanism where the reconstructed pin distribution image provides position and orientation correction information back to the insertion system. This feedback loop enables real-time adjustment of insertion coordinates, ensuring high alignment accuracy while maintaining automatic assembly efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system ensures accurate insertion of electronic components into printed circuit boards, enhancing the efficiency and reducing error rates in automatic through-hole component assembly by overcoming the limitations of traditional photography methods.
Implementation Method 1
the photographing device senses the light, and generates a plurality of first one-dimensional images corresponding to the pins at different rotation angles
Data Source
AI summary
An electronic-component assembly system is provided in the invention. The electronic-component assembly system includes a gripping device, a light-source device, a photographing device, and an image-processing device. The gripping device grips an electronic component, wherein the electronic component includes at least one pin. The light-source device includes a light source and emits light of the light source. The photographing device senses the light and generates a plurality of first one-dimensional images corresponding to the pins at different rotation angles. The image-processing device is coupled to the photographing device to receive the plurality of first one-dimensional images. The image-processing device transforms the plurality of first one-dimensional images into a two-dimensional image, generates adjustment information according to the two-dimensional image, and provides adjustment information to the gripping device, wherein the gripping device adjusts the angle and position of the electronic component according to the adjustment information.