Pin Array Alignment Using Vibration and Magnetic Insertion
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Solution Overview
Problem
The small size of pins in chip manufacturing makes it difficult to erect and arrange them upright during the chip manufacturing process.
Innovation Solution
A pin arrangement device with a storage portion containing a pin arrangement array body with holes, utilizing mechanisms such as vibration, magnetic fields, and suction to insert and arrange pins of micro sizes into corresponding holes, and an inspection unit to verify the insertion ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If pins of micro size are used for chip manufacturing, then integration density is improved, but ease of arrangement and erection becomes difficult
Solution Approach 1:
A pin arrangement array body with multiple holes is introduced as an intermediary carrier. Pins are first placed on this array body where they can be easily positioned, then the entire array body is transferred to the target substrate. This mediator solves the difficulty of directly arranging micro-sized pins while maintaining high integration density.
Solution Approach 2:
Pins are preliminarily arranged and erected on the pin arrangement array body before the final transfer to the substrate. This preliminary arrangement on a larger-scale array body makes the micro-sized pins easier to position and orient correctly, avoiding the difficulty of direct placement on the final substrate.
2Productivity
If vibration mechanism is used to insert pins, then insertion efficiency is improved, but device complexity increases
Solution Approach 1:
A vibration mechanism is applied to the pin arrangement array body during the insertion process. The vibration helps pins settle into the holes more quickly and reliably, significantly improving insertion efficiency. While this adds some device complexity, the benefit in productivity makes it justified.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficiently arranges pins upright by using vibration, magnetic fields, and suction mechanisms, ensuring precise insertion and arrangement of micro-sized pins into holes on the pin arrangement array body.
Implementation Method 1
a first mechanism that vibrates the storage portion
Implementation Method 2
a second mechanism that applies a magnetic field to the pin arrangement array body
Implementation Method 3
a third mechanism that communicates with the holes of the pin arrangement array body disposed in the storage portion and sucks the holes
Data Source
AI summary
A pin arrangement device includes: a storage portion in which a pin arrangement array body having a plurality of holes is disposed; and a mechanism for inserting pins into the holes of the pin arrangement array body disposed in the storage portion. The mechanism includes a first mechanism that vibrates the storage portion and a second mechanism that applies a magnetic field to the pin arrangement array body, and the first mechanism includes a swing mechanism that swings the storage portion and a vibration mechanism that vibrates the storage portion in a vertical direction or a horizontal direction.