Pin Blocking Element Assembly Using Ultrasonic Welding

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Solution Overview

Problem

The existing methods for assembling power modules in electric propulsion vehicles face challenges such as misalignment and high costs due to the complexity and thermomechanical stresses associated with the soldering process of pin holders and pins, leading to inefficiencies and increased material costs.

Innovation Solution

A pin blocking element with a holed body and flanges of varying diameters is used, allowing for ultrasonic welding to a conductive bearing plate, eliminating the need for reflow processes and providing accurate and stable soldering of pin holders and dice without thermomechanical stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional soldering processes are used for pin holders and pins, then assembly can be performed with standard equipment, but misalignment and thermomechanical stresses occur leading to high costs and inefficiencies

Engineering Contradiction:
Improvealignment accuracyVSAvoidsoldering process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the traditional thermal soldering process with ultrasonic welding, which uses mechanical vibration energy instead of heat to join the pin holder to the bearing plate. This substitution eliminates thermomechanical stresses and misalignment issues associated with conventional soldering, while maintaining assembly capability with standard ultrasonic welding equipment.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If reflow processes are used for soldering, then electrical connections can be established, but thermomechanical stresses increase leading to higher costs and reduced efficiency

Engineering Contradiction:
Improveconnection stabilityVSAvoidenergy consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent replaces the thermal reflow soldering process with ultrasonic welding, which uses mechanical vibration at ultrasonic frequencies to create metallurgical bonds. This process occurs at or near room temperature, eliminating the high thermal energy input and associated thermomechanical stresses of reflow processes, while achieving stable electrical connections through direct metal-to-metal bonding.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If conventional pin holder assembly is used, then standard manufacturing processes can be applied, but assembly costs increase and material usage increases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidassembly efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent replaces conventional thermal soldering manufacturing processes with ultrasonic welding, which simplifies the manufacturing process by eliminating flux application, reflow heating, and cleaning steps. The ultrasonic welding process achieves reliable joints in a single step at room temperature, reducing assembly time, material consumption (no flux or solder wire needed), and overall manufacturing complexity while improving productivity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in accurate pin placement, reduced assembly costs, and improved mechanical retention with lower energy consumption and material usage, enhancing the reliability and efficiency of the power module assembly.

Implementation Method 1

The first flange (23) has a larger area than the second flange (24) and is configured to be ultrasonically soldered to a conductive bearing plate (25)

Methodology Applied
Scientific EffectUltrasonic welding: Ultrasonic Vibration

Data Source

PatentUS20240429132A1Blocking element for connecting pins of semiconductor dice
Publication Date: 2024.12.26 STMICROELECTRONICS SRL
  • US20240429132A1 patent drawing
  • US20240429132A1 patent drawing
  • US20240429132A1 patent drawing

AI summary

A blocking element is provided for connecting an electronic, micro-mechanical and/or micro-electro-mechanical component, in particular for controlling the propulsion of an electric vehicle. The pin blocking element is formed by a holed body having a first end, a second end and an axial cavity configured for fittingly accommodating a connecting pin. A first flange projects transversely from the holed body at the first end and a second flange projects transversely from the holed body at the second end. The first flange has a greater area than the second flange and is configured to be ultrasonically soldered to a conductive bearing plate to form a power module.