Pin-Coupled Transformer Packaging for Scalable Galvanic Isolation
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Solution Overview
Problem
Magnetic-coupling isolation barriers, commonly used in electronic systems, face manufacturing challenges for integrated circuit (IC) packages due to the inclusion of a magnetic core, which complicates the production process.
Innovation Solution
The development of a pin-coupled transformer structure with a soft ferromagnetic core and conductive pins connecting substrates, allowing for galvanic isolation while eliminating the need for a magnetic core, enabling a more straightforward and cost-effective manufacturing process for IC packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional magnetic-coupling isolation barriers are used, then galvanic isolation is achieved, but manufacturing complexity increases due to the magnetic core
Solution Approach 1:
The patent extracts the magnetic core from the transformer structure, retaining only the pin-coupled coil structures that provide galvanic isolation. This eliminates the manufacturing complexity associated with magnetic cores while preserving the essential isolation function through direct pin coupling between primary and secondary circuits.
Solution Approach 2:
The patent replaces the traditional magnetic field-based coupling mechanism with a direct electrical pin-coupling mechanism. Instead of using magnetic flux through a core to transfer energy and provide isolation, the invention uses direct conductive pins to couple the primary and secondary circuits, achieving galvanic isolation through the pin structure itself rather than through magnetic coupling.
2Reliability
If traditional magnetic-coupling isolation barriers are used, then galvanic isolation is achieved, but device size increases
Solution Approach 1:
By removing the bulky magnetic core from the transformer structure, the patent significantly reduces the volume required for the isolation barrier. The pin-coupled coil structure occupies minimal space compared to a traditional magnetic core, enabling compact IC package designs while maintaining galvanic isolation functionality.
3Reliability
If traditional magnetic-coupling isolation barriers are used, then galvanic isolation is achieved, but production scalability decreases
Solution Approach 1:
The patent removes the magnetic core component that complicates manufacturing and assembly processes. The simplified pin-coupled structure without a magnetic core enables more straightforward fabrication, assembly, and quality control, thereby improving manufacturing scalability and production efficiency while maintaining galvanic isolation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates the creation of smaller, more scalable, and cost-effective IC packages with galvanic isolation, addressing the manufacturing issues associated with traditional magnetic-coupling methods and enabling efficient voltage isolation.
Implementation Method 1
Magnetic coupling typically relies on use of a transformer to magnetically couple circuits on the different sides of the transformer
Implementation Method 2
a soft ferromagnetic core configured as a closed loop and disposed between the first and second substrates
Data Source
AI summary
Aspects of the present disclosure include systems, structures, circuits, and methods providing pin-coupled transformers and/or pin-coupled coil structures. A pin-coupled coil structure can include first and second substrates, each having a plurality of conductive traces. The conductive traces of the substrates are connected by conductive pins, forming one or more pin-coupled coil structures. Two pin-coupled coils structure can be configured around a transformer core forming a pin-coupled transformer structure. The pin-coupled transformer structure can be included in integrated circuit (chip) packages or modules. The packages and modules may include various types of circuits; in some examples, chip packages or modules may include a galvanically isolated gate driver or other high voltage circuit.