Electronic Component Pin Detection Using Multi-Angle Imaging

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Solution Overview

Problem

In the manufacturing of printed circuit boards, the detection of pin straightening accuracy in electronic components is challenging due to abrasions on cutting tools and inaccurate straightening, leading to abnormal pin yaw, which prevents accurate insertion into the circuit board.

Innovation Solution

A system comprising a light-source device, photography device, and image-processing device that illuminates and captures images of pins at different rotation angles, calculating feature information to analyze pin state and determine if correction is needed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If pin straightening is performed manually or with simple tools, then the operation is simple, but the pin straightening accuracy is low leading to abnormal pin yaw

Engineering Contradiction:
Improvepin straightening accuracyVSAvoiddetection system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent performs pin detection before the pin straightening process. By capturing images of the pins in their initial state and analyzing their orientation, the system determines the actual pin direction beforehand. This preliminary detection enables the subsequent straightening process to be precisely targeted, improving accuracy without requiring overly complex real-time adjustment mechanisms.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces complex mechanical detection and measurement systems with an optical imaging system. Instead of using mechanical gauges or sensors to measure pin orientation, the system uses a camera to capture images and processes these images computationally to determine pin yaw angles. This substitution simplifies the physical hardware while enabling precise digital analysis.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If no detection is performed after pin straightening, then the process is fast and simple, but it is impossible to know whether the pins are abnormal

Engineering Contradiction:
Improvepin state verificationVSAvoiddetection time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent performs detection before the pin straightening operation rather than after. By capturing images of the pins in their initial state, analyzing their orientation, and determining whether correction is needed beforehand, the system eliminates post-straightening detection time while still ensuring reliability through advance verification of pin abnormalities.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The detection system is integrated into the existing production flow and uses the same imaging infrastructure already present for other purposes. The system serves itself by using available light sources and camera systems to perform pin detection without requiring separate dedicated detection equipment, thereby minimizing additional time requirements.

Inventive Principle:
Principle #25Self-service

3Measurement precision

If multiple images are captured at different heights and angles, then the pin state analysis is accurate, but the image processing complexity increases

Engineering Contradiction:
Improvepin orientation measurement accuracyVSAvoidimage processing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the pin into multiple segments by identifying feature points along its length in the captured images. By detecting key geometric features such as the pin head, shaft, and tip separately, the system can calculate orientation angles more accurately. This segmentation approach breaks down the complex task of analyzing the entire pin structure into simpler, manageable feature point detections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent captures images at multiple heights (different z-axis positions) and processes them to extract three-dimensional orientation information. By taking images from different vertical positions along the pin and combining this data, the system can calculate pin yaw angles with higher accuracy. This multi-dimensional imaging approach transforms a two-dimensional image problem into a three-dimensional measurement solution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively detects pin abnormalities, enabling accurate determination of whether pins need correction for proper insertion into the circuit board, thereby improving manufacturing efficiency.

Implementation Method 1

a light-source device (110), a photography device (120)... The light-source device is configured to generate a light to illuminate at least one pin of a first electronic component (150) at different rotation angles

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS10952361B2System and method for detecting electronic components
Publication Date: 2021.03.16 DELTA ELECTRONICS INC(CN)
  • US10952361B2 patent drawing
  • US10952361B2 patent drawing
  • US10952361B2 patent drawing

AI summary

A system for detecting electronic components includes a light-source device, a photography device, an adjustment device, and an image-processing device. The light-source device generates a light to illuminate at least one pin of a first electronic component at different rotation angles. The photography device senses the light and generates first and second images corresponding to the pin of the first electronic component at different rotation angles. The adjustment device adjusts the photography device and the light-source device to a first height and a second height, wherein the first images correspond to the first height and the second images correspond to the second height. The image-processing device calculates first feature information of the pin of the first electronic component according the first and second images, and analyzes the state of the pin of the first electronic component according to the first feature information.