Interchangeable Pin Disk Layout for Fast Ejector Pin Changeover
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Solution Overview
Problem
The existing semiconductor package manufacturing processes face inefficiencies in replacing ejector pins due to the time-consuming manual adjustment required by workers based on their skill level when die sizes change.
Innovation Solution
A semiconductor package manufacturing apparatus and method utilizing a pin holder with through holes, ejector pins, and interchangeable pin disks with adjustable protrusion patterns to efficiently adjust the height of ejector pins, facilitated by a controller for automated selection and replacement of pin disks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If manual adjustment of ejector pins is performed by workers, then the number and position of ejector pins can be changed, but the time required for change increases depending on worker skill
Solution Approach 1:
The ejector pin system is segmented into multiple pin disks, where each disk contains a specific arrangement of ejector pins. This segmentation allows individual disks to be designed for different die sizes and configurations, enabling rapid exchange rather than manual adjustment of each pin. The pin holder is also segmented to accommodate multiple interchangeable disks.
Solution Approach 2:
The pin holder is designed as a universal component that can accommodate multiple types of pin disks with different ejector pin arrangements. This multi-functionality allows the same pin holder to support various die sizes and configurations by simply changing the pin disk, eliminating the need for dedicated pin holders for each die type and reducing changeover time.
2Adaptability or versatility
If the number and position of ejector pins are changed manually, then adaptability to different die sizes is achieved, but manufacturing efficiency decreases due to time-consuming adjustments
Solution Approach 1:
Ejector pins are pre-arranged in multiple pin disks according to different die size requirements and configurations. This preliminary arrangement eliminates the need for manual adjustment during production changes. When a different die size is required, a pre-configured pin disk is simply exchanged into the pin holder, maintaining high manufacturing efficiency while achieving adaptability.
Solution Approach 2:
The ejector pin system transitions from a static, manually-adjustable configuration to a dynamic, interchangeable disk system. The pin disks can be quickly exchanged based on production requirements, allowing the system to adapt dynamically to different die sizes without compromising manufacturing efficiency. The controller enables automated selection and exchange of pin disks.
Data Source
AI summary
A semiconductor package manufacturing apparatus is provided, which comprises a pin holder including a plurality of through holes, a plurality of ejector pins corresponding to the plurality of through holes, a first pin disk including a first protrusion pattern having a first arrangement configured to adjust heights of the plurality of ejector pins, a second pin disk including a second protrusion pattern having a second arrangement configured to adjust the heights of the plurality of ejector pins, and a controller configured to select at least a portion of the plurality of ejector pins to protrude toward an upper portion of the pin holder by selecting one of the first and second pin disks.