Pin Fin Placement Assembly for Cooling IC Dies
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Solution Overview
Problem
The challenge of thermal management in electronic components, such as IC dies, arises from their miniaturization and increased component density, leading to overheating issues that can cause device failure and electrical performance deterioration.
Innovation Solution
A pin fin placement assembly combined with a vacuum pickup assembly is used to accurately position and secure thermal dissipating elements, like pin fins, on IC dies, which are then bonded using a thermal process, optionally integrated with a thermal cooling structure such as a manifold to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the size of electronic components is decreased and the number of integrated components is increased to improve performance, then device performance is improved, but thermal management issues such as overheating occur
Solution Approach 1:
The patent divides the thermal dissipation function into multiple pin fins that are distributed across the IC die surface. Each pin fin acts as an independent heat dissipation element, collectively providing enhanced thermal management for the high-density integrated components.
Solution Approach 2:
The patent extends thermal dissipation from a two-dimensional surface to a three-dimensional structure by adding vertical pin fins. This dimensional transition increases the heat dissipation surface area without increasing the footprint on the IC die, enabling effective cooling of miniaturized high-performance devices.
2Temperature
If multiple pin fins are placed on IC die to improve thermal dissipation, then heat dissipation efficiency is improved, but placement precision and alignment become more difficult
Solution Approach 1:
The patent introduces a carrier substrate as an intermediary tool that holds multiple pin fins in precise alignment during the placement process. The carrier substrate provides reference marks and structural support, enabling accurate positioning of pin fins relative to the IC die without requiring direct manual alignment.
Solution Approach 2:
The patent pre-positions multiple pin fins on the carrier substrate before the actual placement operation. This preliminary arrangement ensures that all pin fins are correctly aligned and spaced, allowing for simultaneous accurate placement on the IC die in a single operation rather than requiring individual positioning.
3Temperature
If thermal dissipating elements are added to IC dies to manage heat, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent designs the pin fins to serve multiple functions: they act as thermal dissipation elements, provide mechanical anchoring points for bonding, and can serve as electrical interconnects. This multi-functionality reduces the need for separate components, thereby managing complexity while achieving effective thermal management.
Solution Approach 2:
The patent combines the thermal dissipation function with the mechanical support and electrical interconnect functions into a single integrated pin fin structure. This merging of functions eliminates the need for separate cooling components, reducing overall device complexity while maintaining effective heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and efficient thermal dissipation, reducing overheating risks and improving the reliability and performance of IC dies by effectively managing heat generated during operation.
Implementation Method 1
The vacuum pickup assembly may provide a suction force that holds the plurality of thermal dissipating elements within the first or second plurality of apertures in the plate body and against a surface of the plate body
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
Methods and structures for providing thermal dissipating elements on integrated circuit ("IC") dies are disclosed. A thermal dissipating element placement assembly, such as a pin fin placement assembly, along with a vacuum pickup assembly, can be used to assist with simultaneous placement of multiple pin fins with desired profiles on desired locations of the IC die. The pin fin placement assembly may be comprised of one or more plates with a plurality of apertures therein for receiving the pin fins. The pin fin placement assembly can be further incorporated into a thermal cooling structure, which can include a manifold configured to encase the IC die and attached pin fins.