Pin-Fin Power Module Mold with Terminal Protection
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Solution Overview
Problem
In traditional power module encapsulation processes, the Pin-Fin structure and terminals are often fully encapsulated by resin, requiring additional drilling to expose them for electrical connections, and the resin can fill gaps between fins, compromising heat dissipation.
Innovation Solution
A mold design with terminal protecting elements, such as recesses on the inner bottom surface, and an injection hole configuration that allows only part of the terminal to be immersed in resin, preventing full encapsulation and allowing exposed terminals for electrical connections without additional drilling, while the edge region of the metal plate prevents resin from reaching the fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the power module with Pin-Fin structure is placed in the cavity formed by the lower mold and the upper mold, then the power module can be encapsulated by epoxy resin, but the gap between two adjacent Fins will be filled with epoxy resin, compromising heat dissipation
Solution Approach 1:
The mold cavity is segmented into multiple regions: a first cavity region for receiving the DBC/IMS with Pin-Fin structure, a second cavity region for receiving terminals, and a third cavity region for receiving power chips. This segmentation allows different areas to be treated differently during encapsulation, preventing resin from entering the Pin-Fin gaps while still providing encapsulation protection where needed.
Solution Approach 2:
Different regions of the mold cavity have different properties and functions. The first cavity region has specific structural features (protrusions, recesses) that locally control resin flow and positioning, ensuring that the Pin-Fin structure is encapsulated in a way that maintains heat dissipation capability while providing protection in other areas.
2Ease of manufacture
If traditional transfer molding process is used, then the power module can be encapsulated by epoxy resin, but the terminals are also fully encapsulated by the epoxy resin, requiring additional drilling process
Solution Approach 1:
The mold cavity is divided into distinct regions, with the second cavity region specifically designed to receive and expose terminals. This segmentation allows terminals to be positioned in a dedicated area where they remain accessible after encapsulation, eliminating the need for post-processing drilling operations.
Solution Approach 2:
The mold design incorporates preliminary positioning features (protrusions, recesses, guide structures) that pre-position the terminals in the correct location before encapsulation. This preliminary action ensures that terminals are automatically exposed in the right positions without requiring additional drilling or modification steps after molding.
Data Source
AI summary
A mold for encapsulating a Pin-Fin type power module with resin is disclosed. The power module includes a DBC or IMS, power chips and multiple terminals provided on a first surface of the DBC or IMS and a Pin-Fin structure provided on a second surface of the DBC or IMS. The mold further includes: a cavity for containing the power module; multiple terminal protecting elements corresponding to the terminals, respectively, each for receiving at least a part of a terminal; and an injection hole provided on the bottom of the mold or on the side wall of the mold, The first surface faces the bottom of the mold and the injection hole is below the first surface when the power module is placed in the cavity. A method for manufacturing a power module is also provided.