Pin Flexure Array for Dissimilar Thermal Expansion
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Solution Overview
Problem
The joining of objects with significantly different coefficients of thermal expansion poses challenges in achieving a secure and stable interconnection, particularly in applications requiring precise alignment and thermal stability, as existing methods often result in mechanical strain, alignment errors, and poor thermal conductivity.
Innovation Solution
An interconnector system featuring a base with a pin array, where the pins extend from the base to accommodate thermal expansion, providing mechanical flexure and thermal conductivity, and secured using an adhesive, minimizing the number of parts and joints to enhance durability and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If welding or adhering techniques are used to join components with different thermal coefficients, then a secure connection is achieved, but mechanical strain and alignment errors are introduced
Solution Approach 1:
The connection interface is segmented into multiple discrete pins rather than a continuous weld or adhesive bond. This segmentation allows localized flexibility at each pin while maintaining overall structural integrity, preventing the propagation of thermal strain across the entire connection interface.
Solution Approach 2:
The pin geometry parameters (diameter, length, spacing) are optimized to balance rigidity and flexibility. The pins are designed with specific dimensional ratios that allow them to flex under thermal stress while maintaining precise alignment, changing the mechanical parameters of the connection to accommodate differential thermal expansion.
2Stress or pressure
If an interposer is introduced to reduce thermally induced strain, then strain reduction is achieved, but mechanical settling problems increase
Solution Approach 1:
The pin array acts as an intermediary element between components with different thermal coefficients. Rather than using a traditional interposer that adds complexity, the pins provide a direct but flexible connection that mediates the thermal stress while maintaining mechanical stability through their array configuration.
Solution Approach 2:
The connection system uses a composite approach combining rigid base structures with flexible pin elements. This composite design allows the system to exhibit both the strength of rigid connections and the flexibility needed to accommodate thermal expansion differences, achieving both strain reduction and mechanical stability.
3Reliability
If high machining and alignment tolerances are required for secure joining, then connection security is improved, but manufacturing difficulty and cost increase
Solution Approach 1:
The connection is divided into multiple discrete pin locations that can be manufactured and assembled independently. This segmentation allows for easier manufacturing and assembly compared to requiring precise continuous interfaces, as each pin can be positioned and secured separately with relaxed tolerances.
Solution Approach 2:
The pin array design incorporates dynamic flexibility that compensates for manufacturing tolerances. The pins can flex and adjust to accommodate variations in positioning, allowing secure connections to be achieved without requiring extremely tight manufacturing tolerances, thus improving ease of manufacture while maintaining reliability.
4Stability of the object's composition
If flexure mounting is used to join components, then mechanical flexibility is achieved, but thermal conductivity becomes poor
Solution Approach 1:
The pin array provides localized thermal conduction paths at each pin location while maintaining overall mechanical flexibility. By concentrating thermal conduction at specific points rather than requiring continuous thermal contact, the design achieves both flexure mounting benefits and acceptable thermal conductivity without needing additional thermal straps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interconnector system securely joins components with different thermal coefficients, maintaining precise alignment and stability over a wide temperature range while improving thermal conductivity and reducing mechanical hysteresis and part count complexity.
Implementation Method 1
The pins included in the pin array are configured to accommodate thermal expansion of a component bonded to the free ends of the pins
Implementation Method 2
The pin array...provide mechanical flexure
Implementation Method 3
a component including but not limited to a detector package that is connected to the free ends of the pins included in the pin array by an adhesive
Data Source
AI summary
Interconnection systems and methods are provided. An interconnector as disclosed allows for a first component having a first coefficient of thermal expansion to be joined to a second component having a second coefficient of thermal expansion securely, and while maintaining a precise alignment between the components. The interconnector generally includes a plurality of pins that each have a free end that is adhered to the first component for imaging, sensing, tracking, processing, and other applications.