Pin Frame Assembly for Package Module Efficiency
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Solution Overview
Problem
The existing methods for assembling housing type package modules are inefficient, requiring individual placement and soldering of pins on a circuit substrate, which is time-consuming and labor-intensive.
Innovation Solution
A method involving a pin frame with multiple pins is used to simultaneously place pins on bonding areas of a circuit substrate, followed by cutting off the connection portion and bending the pins to be vertical, thereby simplifying the assembly process and enhancing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual pins are placed and soldered on a circuit substrate one by one, then each pin can be precisely positioned on bonding areas, but the assembly process is time-consuming and labor-intensive
Solution Approach 1:
Multiple pins are merged into a single pin frame structure, allowing all pins to be placed and soldered to the circuit substrate simultaneously in one operation rather than individually. This combining approach maintains positioning precision through the frame structure while dramatically improving assembly efficiency by reducing the number of discrete placement operations.
Solution Approach 2:
The pins are pre-positioned and connected to each other through the pin frame structure before being transferred to the circuit substrate. This preliminary arrangement ensures precise positioning is achieved in advance, and the entire pin assembly can then be transferred and soldered as a unit, improving overall assembly efficiency.
2Strength
If pins are bent after soldering to be vertical to the circuit substrate, then structural integrity is improved, but additional processing steps are required
Solution Approach 1:
The pin structure is segmented into distinct functional portions: a soldering portion for attachment to bonding areas, a pin body that becomes vertical after bending, and a bending portion with varying cross section that facilitates the bending operation. This segmentation allows the bending step to be efficiently integrated into the manufacturing process while achieving the required structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces assembly time by allowing all pins to be placed and fixed in one operation, and the bending of pins enhances the package module's structural integrity and assembly efficiency.
Implementation Method 1
bonding the pins to bonding areas on the circuit substrate
Data Source
AI summary
A method of fabricating a package module includes placing a pin frame having plural pins on a circuit substrate; bonding the pins to corresponding bonding areas on a circuit substrate, thereby connecting the pins to the bonding areas; cutting off a connecting portion of the pin frame; and bending the pins to be vertical to the circuit substrate. By placing the pins on the corresponding bonding areas on the circuit substrate through the pin frame, and then cutting off the connecting portion of the pin frame and bending the pins, the efficiency of assembling the package module can be greatly promoted.