Intelligent Power Module Pin Frame Structure for Dense Solder Bonding

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Solution Overview

Problem

The challenge of reliably bonding an intermediate frame to pins on a substrate in intelligent power modules is exacerbated by high pin density, limited bonding area, and poor reliability, leading to a high risk of short circuits and dislocation during reflow soldering.

Innovation Solution

The implementation of connection structures with support portions on an external pin frame that isolate adjacent solder pins, preventing bonding materials from splashing out and flowing to adjacent pins, thereby reducing the risk of short circuits and ensuring accurate connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high pin density is used on the substrate, then the bonding area is reduced, but the number of connections increases

Engineering Contradiction:

Improveconnection densityVSAvoidbonding area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The connection structure is segmented into support portions that are distributed between adjacent solder pins. These support portions divide the bonding space into isolated regions, allowing each solder pin to have its own dedicated bonding area while maintaining high pin density on the substrate.

Inventive Principle:

Principle #1Segmentation

2Productivity

If high pin density is used on the substrate, then more connections are achieved, but the risk of short circuit increases

Engineering Contradiction:

Improveconnection densityVSAvoidshort circuit risk

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The support portions segment the bonding area into isolated regions between adjacent solder pins. This segmentation prevents bonding materials from flowing between adjacent pins during reflow soldering, thereby eliminating the short circuit risk while maintaining high connection density.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support portions act as intermediary structures between adjacent solder pins. They serve as physical barriers that prevent bonding materials from directly contacting adjacent pins, thus mediating the potential short circuit hazard while allowing the high pin density configuration to remain.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If bonding area is limited, then manufacturing is simplified, but bonding reliability deteriorates

Engineering Contradiction:

Improvebonding process simplicityVSAvoidbonding structure reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The support portions segment the limited bonding area into multiple isolated zones, each dedicated to a specific solder pin. This segmentation ensures that bonding materials remain confined to their designated areas, preventing short circuits and enhancing bonding reliability without complicating the manufacturing process.

Inventive Principle:

Principle #1Segmentation

4Reliability

If support portions are added to connection structures, then short circuit risk is reduced, but device complexity increases

Engineering Contradiction:

Improveshort circuit preventionVSAvoidconnection structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The connection structure is segmented by adding support portions between adjacent solder pins. These support portions create isolated bonding regions that prevent short circuits. The segmentation is achieved through a relatively simple structural modification that does not significantly increase overall device complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support portions are strategically placed only where needed - between adjacent solder pins in the bonding area. This local modification improves reliability at critical locations without unnecessarily complicating the entire connection structure. The support portions have specific local functions of isolation and confinement.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The connection structures effectively reduce the risk of short circuits and dislocation during reflow soldering, ensuring stable and accurate connections between leads and solder pins.

Implementation Method 1

during reflow soldering

Methodology Applied

Scientific EffectReflow soldering: Soldering

Data Source

PatentUS12557713B2Intelligent power module and manufacturing method thereof

Publication Date: 2026.02.17 EDGELESS SEMICON CO LTD OF ZHUHAI

AI summary

Disclosed are an intelligent power module and a manufacturing method thereof, which relate to the technical field of electronic devices. The intelligent power module includes a substrate, wherein a chip and a plurality of conductive pins are arranged on the substrate, one end of each of the conductive pins is connected to the chip, and a solder pin is formed at an end portion of the other end of the conductive pin; and an external pin frame, including a plurality of leads, and a connection structure is formed at an end portion of one end of each of the lead; and the connection structure includes a connection portion, and support portions, wherein an arrangement direction of the support portions is the same as that of the solder pins, an accommodation space is formed between the two support portions, and the solder pin is located between the two support portions.