Pin Header Assembly Using FR-4 Laminate and Press Fit
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Solution Overview
Problem
Existing pin headers for printed circuit boards are costly for low volume production due to expensive materials and tooling requirements, making them unsuitable for research and development projects and low volume applications.
Innovation Solution
A pin header assembly formed with a heat-resistant, electrically insulating base made from thermoset glass epoxy laminate material, using a press fit for conductive pins and existing tools to reduce costs, with the base and pins bonded to the printed circuit board using solder paste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If specialized thermoplastics are used for the base material to withstand high temperatures and provide electrical insulation, then heat resistance and electrical insulating properties are improved, but material cost increases
Solution Approach 1:
The patent uses the same material (FR-4 glass epoxy laminate) for both the printed circuit board and the pin header base, eliminating the need for specialized expensive thermoplastics. This homogeneity in material selection reduces cost while maintaining the required heat resistance and electrical insulating properties, as the FR-4 material already withstands reflow soldering temperatures up to 260°C or more.
Solution Approach 2:
The patent changes the material parameter from specialized heat-resistant thermoplastics to standard FR-4 glass epoxy laminate, which has proven thermal and electrical properties suitable for PCB applications. This parameter change maintains reliability while significantly reducing material cost for low volume production.
2Manufacturing precision
If over-molding processes are used to form the base about pins, then manufacturing precision is improved, but tooling cost and device complexity increase
Solution Approach 1:
The patent separates the base and pins into distinct components that are manufactured independently and then assembled together. The base is formed from FR-4 laminate using standard PCB fabrication processes, and pins are inserted through pre-formed openings. This segmentation eliminates the need for complex over-molding tooling while maintaining acceptable manufacturing precision through standard drilling and insertion techniques.
Solution Approach 2:
The patent uses universal standard tools and processes for PCB fabrication (drilling, routing, soldering) to manufacture the pin header assembly, rather than requiring specialized over-molding equipment. This multi-functionality of standard PCB tools reduces tooling cost and device complexity while achieving the required manufacturing precision.
3Manufacturing precision
If specialized pin pushing and stamping tools are used, then manufacturing precision is improved, but tooling cost and ease of manufacture worsen
Solution Approach 1:
The patent employs universal standard PCB assembly techniques for pin insertion, such as through-hole drilling and manual or automated insertion methods already common in PCB manufacturing. This avoids the need for specialized pin pushing and stamping tools, reducing tooling cost while maintaining sufficient manufacturing precision for low volume production.
4Reliability
If traditional pin header assemblies are used, then electrical connection reliability is improved, but shipping cost increases
Solution Approach 1:
The patent merges the pin header base with the printed circuit board by forming the base from the same FR-4 laminate material used for the PCB, creating an integrated structure. This merging eliminates separate shipping of the base component and reduces overall shipping cost, while the integrated construction maintains electrical connection reliability through direct soldering of pins to the PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces tooling, shipping, and material costs, enabling cost-effective pin header assemblies for low volume production and research applications while maintaining heat resistance and electrical integrity.
Implementation Method 1
The pin headers are affixed to the printed circuit board through reflow soldering process, using soldering paste, to ensure electrical connection.
Data Source
AI summary
Improved pin header assemblies, printed circuit board assemblies and methods of forming the same are disclosed. In an aspect, a method of forming a pin header assembly for use with a printed circuit board is provided. The method includes the step of providing a base formed of an electric insulator. The method further includes the step of forming a plurality of openings through the base. The method further includes the step of inserting a plurality of conductive pins through the openings, wherein a press fit is formed between the conductive pins and the base, and the conductive pins extend from opposite sides of the base.