Pin Wire Formation Using Capillary Scraping at Narrow Pitch
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Solution Overview
Problem
Forming a pin wire on a semiconductor chip or substrate without pressing a portion of the wire at a location different from the bonding position is challenging, especially when the pin wire height is limited and the pitch is narrow, leading to potential interference with adjacent pin wires.
Innovation Solution
A method involving a bonding process, wire feeding, pressing, scraping, and cut-off processes using a bonding tool with an inner edge to form a scrape on the wire, allowing the wire to be cut off at the scrape and extended vertically from the bonding position without additional pressing, utilizing a bonding tool with a recess and through-hole design and ultrasonic vibration for effective scraping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a wire is pressed at another location on the semiconductor chip or substrate to form a pin wire, then the pin wire can be formed extending vertically upward, but there may be no space for pressing the wire when the pin wire height is limited or the pitch is narrow
Solution Approach 1:
The invention extracts the pressing operation from the traditional process where wire is pressed at a separate location on the chip surface. Instead, the bonding tool itself performs the pressing function at its tip location, eliminating the need for additional pressing space on the chip surface while still achieving the desired pin wire formation.
Solution Approach 2:
The bonding tool is designed to perform multiple functions: bonding the wire to the electrode, pressing the wire at the tip location, and forming the pin wire. This multi-functionality eliminates the need for separate pressing operations and additional space on the chip surface.
2Manufacturing precision
If a portion of the wire is pressed at another position to form a pin wire, then the wire can be extended vertically upward, but the pressed wire may interfere with adjacent pin wires when the pitch is narrow
Solution Approach 1:
The invention applies pressing force locally at the wire tip location through the bonding tool, rather than pressing at a separate location that could affect adjacent areas. This localized approach ensures that each pin wire is formed independently without interfering with adjacent pin wires, even at narrow pitches.
3Manufacturing precision
If the bonding tool is used to press the wire at another location, then additional pressing space is required, but the space may not be available when pin wire height is limited
Solution Approach 1:
The invention extracts the pressing operation from the chip surface area and performs it at the bonding tool tip location. This eliminates the requirement for additional pressing space on the chip surface, enabling pin wire formation even when the available space is limited by the pin wire height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable formation of pin wires without additional pressing, even in space-constrained environments and without interfering with adjacent wires, ensuring consistent and efficient pin wire formation across varying pitches.
Implementation Method 1
after ultrasonically vibrating a bonding tool with a wire being pressed onto an electrode by the bonding tool to bond the wire and the electrode
Implementation Method 2
the bonding tool is ultrasonically vibrated to bond the wire and the lead
Implementation Method 3
the tip of the bonding tool is vibrated to form a scrape on the wire by the inner edge of the bonding tool
Data Source
AI summary
The present invention includes a bonding process of bonding a wire to an electrode by a capillary, a wire feeding process of raising the capillary to feed the wire from a tip, a pressing process of moving the capillary to press an inner edge of the capillary against the wire, a scraping process of vibrating the tip of the capillary to form a scrape on a side surface of the wire by the inner edge of the capillary, and a cut-off process of closing a wire clamper and cutting off the wire at a portion of the scrape to form a pin wire extending vertically upward from the electrode.