Semiconductor Pin Wire Bonding With Dummy Electrode Height Control
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Solution Overview
Problem
Conventional methods for forming pin wires on densely arranged electrodes of semiconductor devices face challenges in adjusting wire height due to space constraints, potentially causing damage to semiconductor chips, and lack flexibility in wire shape formation.
Innovation Solution
A method involving a bonding tool to form a pin wire through a bonding process, looping wire formation, pressing, and separation process, with adjustable looping heights and use of dummy electrodes to reduce chip damage, allowing for precise control over wire shape and height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a part of the wire is pressed at a location on the semiconductor chip to form a pin wire, then the pin wire can be formed, but the semiconductor chip may be damaged due to small withstand load at the pressing location
Solution Approach 1:
The patent introduces a dummy electrode as an intermediary pressing position. This dummy electrode serves as a mediator between the wire and the semiconductor chip, allowing the wire to be pressed without directly applying force to the chip structure. The dummy electrode absorbs the pressing load, preventing damage to the semiconductor chip while enabling pin wire formation.
2Object-affected harmful factors
If a part of the wire is pressed at a specific position such as a dummy electrode, then chip damage is reduced, but the distance between electrode and pressing position cannot be freely selected, making it difficult to adjust pin wire height
Solution Approach 1:
The patent makes the looping height adjustable, allowing the wire to form loops of different heights between the electrode and the dummy electrode. This dynamic adjustment capability enables flexible control of pin wire height while maintaining the dummy electrode as the fixed pressing position, thus preserving both chip safety and height adaptability.
Solution Approach 2:
The patent utilizes the vertical dimension by allowing the wire to loop upward to different heights before being pressed down at the dummy electrode position. This vertical looping provides an additional degree of freedom for adjusting pin wire height without changing the horizontal pressing position, resolving the contradiction between fixed pressing location and adjustable wire height.
3Adaptability or versatility
If the wire is pressed at a location outside the semiconductor chip, then pin wire height can be freely adjusted, but space constraints in densely arranged electrodes prevent this approach
Solution Approach 1:
The dummy electrode serves multiple functions: it acts as a pressing position for wire formation, provides a load-bearing structure to prevent chip damage, and enables pin wire height adjustment through variable looping heights. This multi-functional design allows the system to achieve external-pressing benefits within the limited chip area.
4Device complexity
If conventional bonding methods are used with densely arranged electrodes, then manufacturing is simplified, but the degree of freedom in wire shape is limited
Solution Approach 1:
The patent introduces dynamic control of the wire bonding process, allowing the wire to form adjustable loops with variable heights. This dynamic approach enables diverse wire shapes and pin wire heights while maintaining a relatively simple manufacturing process using standard bonding equipment with programmable motion control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the degree of freedom in wire shape and reduces damage to semiconductor chips by using dummy electrodes and ball bonding techniques, enabling precise adjustment of pin wire height and shape.
Implementation Method 1
bonding a wire to a first bonding point with the bonding tool
Implementation Method 2
pressing a part of the wire against the second bonding point to form a thin portion
Data Source
AI summary
The semiconductor device manufacturing method includes a bonding step of bonding a wire to an electrode (35a), a looping wire formation step of looping the wire from the electrode (35a) to a dummy electrode (34) to form a looping wire (50a), a pressing step of pressing a part of the wire, a moving step of moving the pressed part of the wire directly above the electrode, a wire separation step of separating the wire partially from a wire supply to form a pin wire (55a) extending vertically upward from the electrode (35a), wherein the looping wire formation step adjusts the looping height of the wire to set the length of the looping wire to a predetermined length.