Pinless Chip Package Structure for Shorter Signal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing package structures for electronic products are large in size due to the use of pins and long wire-bond paths, which hinder miniaturization and integration, and pose a risk of parasitic effects.
Innovation Solution
A package structure that eliminates the need for pins by using a connecting assembly with a line layer to directly lead signals from the chip pad to the package body, incorporating a thermally conductive substrate for heat dissipation, and employing a heat sink for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pins are used in housing package or molding package, then the package structure can be formed with conventional pin-based packaging methods, but the product size becomes large
Solution Approach 1:
The patent removes the pin component from the package structure entirely. Instead of using conventional pins that extend from the package body, the invention uses a wire-bond frame with integrated connection structures that eliminate the need for separate pins, thereby reducing the overall product size while maintaining electrical connectivity functions
Solution Approach 2:
The patent combines the wire-bond frame structure with the package body connection function. The wire-bond frame serves dual purposes: it provides the mechanical support structure and simultaneously creates the electrical connection paths, merging what were previously separate components (frame + pins) into an integrated structure
2Ease of manufacture
If pins are used in both housing package and molding package, then conventional packaging methods can be applied, but the wire-bond path becomes excessively long causing parasitic effects
Solution Approach 1:
The patent extracts and removes the pin component that necessitates long wire-bond paths. By using the wire-bond frame structure directly for connections, the wire-bond paths are significantly shortened, eliminating the source of parasitic effects while maintaining manufacturability through conventional wire-bonding processes
Solution Approach 2:
The wire-bond frame acts as an intermediary structure that provides direct connection points within the package body. This intermediate structure eliminates the need for long external wire-bond paths by creating localized connection points, thereby reducing parasitic effects while maintaining electrical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the overall size and parasitic effects, facilitates miniaturization, and improves heat dissipation, while simplifying the manufacturing process and reducing assembly costs.
Implementation Method 1
incorporating a thermally conductive substrate for heat dissipation
Implementation Method 2
employing a heat sink for enhanced cooling
Data Source
AI summary
This application discloses a package structure and a package system. The package structure may be used for packaging various types of chips, and is coupled to a PCB, so as to form the package system. The package structure includes a package base layer, a chip, a package body, and a connecting assembly. The package base layer has a first surface and a second surface that are opposite to each other. The chip is coupled to the first surface, and there is a chip pad on a surface that is of the chip and that is away from the package base layer. The package body covers the package base layer and the chip to protect the structure, and the chip pad is wired to a surface of the package body through the connecting assembly.