Pin-Less Pedestal Plate Transfer for Harsh Processing Chambers
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Solution Overview
Problem
Conventional substrate transfer methods in high-pressure and high-temperature semiconductor processing chambers are prone to component degradation, leading to frequent replacements and increased maintenance costs due to the harsh environment and corrosive conditions.
Innovation Solution
A pin-less substrate transfer apparatus and method using a pedestal plate with cutouts and recesses, eliminating the need for lift pins and magnetic lift systems, which simplifies chamber design, reduces temperature non-uniformity, and decouples substrate transfer from temperature sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional lift pins and magnetic lift systems are used for substrate transfer, then substrate transfer function is achieved, but component degradation occurs due to harsh high-temperature and high-pressure environment
Solution Approach 1:
The patent removes lift pins and magnetic lift systems from the substrate transfer mechanism, eliminating the components that degrade in harsh environments. The substrate is transferred directly through mechanical contact with the pedestal plate surface, which is inherently resistant to high-temperature and high-pressure conditions.
Solution Approach 2:
The pedestal plate is designed as a simple, robust component that can withstand harsh conditions without degradation. Rather than using expensive, sensitive magnetic or mechanical lift components that require frequent replacement, the system uses a durable plate that maintains its functionality throughout the chamber's operational life.
2Productivity
If lift pins and magnetic lift systems are used, then substrate transfer is achieved, but maintenance frequency increases and maintenance costs increase
Solution Approach 1:
By removing lift pins and magnetic lift systems, the patent eliminates the complex components that require maintenance. The simplified pedestal plate structure has no moving parts, seals, or magnetic elements that could fail, thereby eliminating maintenance requirements entirely.
3Ease of operation
If conventional substrate transfer apparatus is used, then substrate transfer function is provided, but chamber internal volume is increased and processing gas requirements are increased
Solution Approach 1:
The patent eliminates the need for complex transfer mechanisms, seals, and associated components that occupy chamber volume. The direct-contact substrate transfer method requires minimal structural elements, maximizing the usable internal volume of the processing chamber and reducing the amount of processing gas required.
Data Source
AI summary
The present disclosure generally relates to a pin-less substrate transfer apparatus and method for a processing chamber. The processing chamber includes a pedestal. The pedestal includes a pedestal plate. The pedestal plate has a radius, a top surface, and a bottom surface. The pedestal plate further includes a plurality of cut outs on a perimeter of the pedestal plate. Flat edges are disposed on opposite sides of the pedestal plate. Recesses are disposed in the bottom surface below each of the flat edges.