Pipe Coating Curing Head With Air-Cooled LED Heat Sinks
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Solution Overview
Problem
The existing methods for curing internal pipe coatings are slow due to the need for multiple thin layers, which is influenced by the viscosity of the coating substance, requiring prolonged curing times and multiple application cycles.
Innovation Solution
A device featuring light emitting diodes cooled by heat sinks and air flow, with a specific air flow direction to expedite curing while minimizing disturbance to uncured surfaces, utilizing a flexible shaft and duct configuration with integrated cooling channels to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple thin coating layers are applied to achieve adequate coating thickness, then the coating quality and evenness are improved, but the total curing time increases significantly
Solution Approach 1:
The patent applies dynamic cooling by directing air flow through cooling channels in the curing device body, allowing the system to adapt to heat generation during operation. The cooling system dynamically adjusts to maintain optimal curing conditions, enabling faster curing speeds without compromising coating quality
Solution Approach 2:
The patent introduces air flow as an intermediary cooling medium that passes through heat sinks and cooling channels. This intermediary system efficiently removes heat from the LEDs and device body, enabling sustained high-intensity curing that reduces total curing time while maintaining coating evenness
2Productivity
If high intensity light is used to accelerate curing, then the curing speed is improved, but the heat generation increases and may disturb uncured coating surfaces
Solution Approach 1:
The patent segments the cooling function into multiple components: cooling channels in the device body, heat sinks attached to LEDs, and air flow paths. This segmentation allows efficient heat removal from critical areas without requiring excessive cooling that would disturb the coating
Solution Approach 2:
The patent converts the harmful heat generated by high-intensity curing LEDs into a manageable thermal flow that can be directed through cooling channels. The heat is channeled through the device body and removed systematically, transforming a potential harmful effect into a controlled thermal management process
3Loss of energy
If cooling channels are integrated into the device body, then the cooling efficiency is improved, but the device complexity increases
Solution Approach 1:
The device body serves multiple functions: it houses the curing LEDs, provides structural support, and acts as a cooling manifold with integrated cooling channels. This multi-functionality reduces the need for separate cooling components, maintaining relatively simple device construction while achieving efficient heat removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the curing time of the coating substance, allowing for faster completion of the coating process without compromising the evenness and thickness of the coating layers.
Implementation Method 1
The device (30) comprises a plurality of light emitting devices (42) which are cooled with heat sinks (48) and air flow
Implementation Method 2
Device for curing coating substance
Implementation Method 3
The one or more heat sinks (48) are in connection with the light emitting devices (42), wherein heat formed in the light emitting devices (42) is conducted to the one or more heat sinks (48)
Implementation Method 4
air flow through the heat sink, air exits the device through an air outlet channel
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The present disclosure concerns a device (30) for curing a coating substance inside a pipe. The device (30) comprises a flexible shaft (12) inside a duct (10), an air inlet channel (14) within the duct (10), a body (32) configured to be attached to the duct (10), a heat sink (48) in connection with the body (32) and defining a plurality of cooling channels (44) which are in fluid connection with the air inlet channel (14), and a plurality of light emitting devices (42) configured to be cooled by the heat sink (48). The device further comprises an air outlet channel (34) in fluid connection with the cooling channels (44) of the heat sink (48), and the air outlet channel (34) exits the body (32) from the same side of the body (32) as the air inlet channel (14) enters the body (32).