Pipe conduit panel and floor structure

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Solution Overview

Problem

In underfloor heating systems, continuous connecting lines pose challenges in temperature regulation due to their layout, leading to overheating in small rooms and inefficiencies in energy use, as they must be laid with small laying distances and can cause excessive heating in adjacent areas.

Innovation Solution

A pipeline panel with adjustable pipe guide channels that allow for height changes, enabling connecting pipelines to be raised from an insulation level to a higher screed level, reducing overheating and improving temperature control by integrating pipes directly into the insulation level, thus allowing for separate heating circuit installation and regulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If connecting pipelines are laid on insulation over bare floor, then heat dissipation is constant and meets regulatory requirements, but rooms become overheated and energy efficiency decreases

Engineering Contradiction:
Improveroom temperatureVSAvoidenergy efficiency
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent introduces a vertical dimension change by raising connecting pipelines from the floor level (first laying plane) to the screed level (second laying plane) using pipeline panels with inclined pipe guide channels. This dimensional transition allows pipes to be positioned within the thermal mass of the screed rather than remaining on the insulation surface, thereby reducing unwanted heat dissipation into the floor structure and improving room temperature control and energy efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If connecting pipelines are raised from insulation level to screed level, then temperature control is improved and overheating is reduced, but height offsets and construction steps must be compensated

Engineering Contradiction:
Improveroom temperature controlVSAvoidheight compensation structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent divides the floor structure into distinct segments: the insulation layer at floor level, the pipeline panel with inclined channels for height transition, and the screed layer at the elevated level. This segmentation allows connecting pipelines to be laid on the insulation up to the door frame area, then transitioned vertically through the pipeline panel to the screed level, compensating for height offsets without requiring complex continuous structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The pipeline panels incorporate inclined and curved pipe guide channels that smoothly transition pipes from the horizontal floor level to the elevated screed level. This curved transition path within the pipeline panel effectively compensates for construction-related steps and ledges, enabling seamless height compensation while maintaining pipeline integrity.

Inventive Principle:
Principle #14Spheroidality (Curvature)

3Ease of operation

If connecting pipelines are laid with small laying distances, then continuous supply lines can be installed, but adjacent rooms are heated above target temperature

Engineering Contradiction:
Improvepipeline installationVSAvoidadjacent room temperature
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

The patent extracts the connecting pipelines from the room level insulation and repositions them to the screed level using pipeline panels with inclined channels. By removing pipes from the direct path over small rooms and corridors and elevating them into the thermal mass of the screed, the system prevents these pipes from contributing to overheating in adjacent rooms while maintaining the ease of continuous pipeline installation.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for seamless transitions across different laying levels, reduces overheating by up to 7°C, enhances energy efficiency, and enables precise temperature control in rooms, meeting regulatory standards like EnEV 2014 and DIN EN 1264.

Implementation Method 1

Heat dissipation into the unfinished floor, e.g. concrete, is constant and meets the requirements of EnEV 2014 and DIN EN 1264

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3396257B1Pipe conduit panel and floor structure
Publication Date: 2020.10.28 UPONOR INNOVATION AB
  • EP3396257B1 patent drawingFigure 1~2
  • EP3396257B1 patent drawingFigure 3

AI summary

The invention relates to a pipe panel (1) for guiding at least one connecting pipe of an underfloor heating system, having an installation board (2) into which at least one first pipe routing channel (6) open to an upper side (4) of the installation board (2) is introduced for receiving a connecting pipe , wherein the first pipe guide channel (6) has at least one course section with a section start (9) and a section end (10), and wherein the first pipe guide channel (6) is formed from the section start (9) to the section end (10) in such a way, that a connecting pipeline laid in the first pipe routing duct (6) is transferred from a first laying level (7) at the section start (9) to a second laying level (8) at the section end (10) with respect to the upper side (4). The invention also relates to a floor structure (30).