Pipe Connection Element Recess for Solder Management
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Solution Overview
Problem
In line arrangements, especially in motor vehicle technology, excess solder deposited on functional surfaces can impair sealing functions and cause assembly issues due to capillary effects, leading to solder accumulation on critical sealing or guide surfaces.
Innovation Solution
A recess is created between the functional surface and the soldered connection to collect excess solder, featuring a tear-off edge that prevents solder from flowing onto the functional surface, ensuring optimal sealing or fitting functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a soldered connection is made to fix the connecting element, then the connecting element is securely fixed, but excess solder flows onto the functional surface due to capillary effect, impairing sealing function and assembly
Solution Approach 1:
The base body is segmented into distinct functional zones: a soldering area, a functional surface area, and an intermediate transition area with a recess. This segmentation prevents solder from the soldering area from reaching the functional surface area, resolving the contradiction between secure fixing and reliable sealing.
Solution Approach 2:
The recess acts as an intermediary structure between the soldered connection and the functional surface. It serves as a buffer zone that intercepts excess solder, preventing direct contact between solder and the functional surface, thus maintaining both fixing strength and sealing reliability.
2Strength
If solder is applied generously to ensure strong connection, then connection strength is improved, but solder accumulation on functional surfaces causes assembly problems and sealing impairment
Solution Approach 1:
The harmful effect of excess solder is extracted and isolated into a dedicated recess structure. By providing a specific receptacle for solder accumulation, the system allows generous solder application for strength while preventing the harmful accumulation on functional surfaces that would impede assembly.
Solution Approach 2:
The recess converts the harmful effect of excess solder (which would otherwise damage the functional surface) into a beneficial feature by providing a designated collection area. The solder that would be harmful on the functional surface becomes contained and harmless in the recess, allowing strong connections without assembly problems.
3Ease of manufacture
If the functional surface is exposed directly to the soldered connection area, then manufacturing is simpler, but solder contamination occurs, requiring additional cleaning or protection measures
Solution Approach 1:
The recess is formed in advance during the turning process as a preliminary structural feature. This pre-formed recess is then automatically functional during soldering, intercepting solder before it reaches the functional surface. The manufacturing simplicity is maintained while achieving surface cleanliness through this preliminary geometric feature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recess effectively prevents solder from adhering to functional surfaces, maintaining their intended functions and facilitating assembly by containing excess solder, thus enhancing the reliability of line arrangement connections.
Implementation Method 1
The recess serves to stop uncontrolled flowing solder or solder from flowing onto the functional surface due to the capillary effect.
Data Source
Figure 1~2
Figure 3
AI summary
The connecting element (13) has a base body (14) with a connecting section (17), where the connecting section has a functional surface (18,24). A connecting element is connected with the base body by a soldered connection (28). A recess is provided between the functional surface and the soldered connection.