Redundant Pipeline Temperature Control for Thermocouple Failure
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Solution Overview
Problem
Existing semiconductor processing technologies face interruptions and wafer scrap due to failures in temperature control thermocouples, leading to adverse impacts on process continuity.
Innovation Solution
A pipeline temperature control equipment and method that includes multiple heating assemblies along the temperature-controlled pipeline, each equipped with a heating device, two temperature measuring devices, and a control device. This setup allows for real-time temperature monitoring and control, ensuring target temperatures are met even if one or both temperature measuring devices fail.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single temperature control thermocouple is used to regulate heating, then the device complexity is reduced, but the reliability of temperature control deteriorates due to potential malfunction causing process interruption
Solution Approach 1:
The patent applies beforehand cushioning by implementing a backup temperature measuring device that activates when the primary thermocouple fails. This preparatory measure ensures continuous temperature monitoring and heating control capability, preventing process interruption without requiring complex redundant systems for normal operation
Solution Approach 2:
The patent changes the operational parameter of the heating device by adjusting heating power based on temperature measurements from either the primary or backup thermocouple. When the primary thermocouple fails, the system switches to using the backup device's measurements, maintaining continuous temperature control with modified parameter sources rather than system architecture
2Reliability
If redundant temperature measuring devices are added to prevent failure, then the reliability of temperature control is improved, but the device complexity increases
Solution Approach 1:
The backup temperature measuring device is installed in advance as a standby component, remaining dormant during normal operation. This allows the system to achieve high reliability through pre-positioned redundancy without the complexity of active dual-channel monitoring, as the backup only activates upon primary failure
Solution Approach 2:
The system implements self-service through automatic failover detection and switching between primary and backup thermocouples. The control device automatically detects when the primary temperature measuring device fails and switches to the backup without requiring external intervention or complex manual reconfiguration, simplifying the operational complexity
3Productivity
If continuous monitoring with multiple temperature measuring devices is implemented, then the productivity is maintained during potential failures, but the manufacturing cost increases due to additional components
Solution Approach 1:
The backup temperature measuring device serves as a pre-positioned safeguard that only becomes active upon primary failure. This approach maintains productivity by ensuring continuous temperature monitoring capability while minimizing the quantity of actively used components, as the backup remains dormant during normal operation
Solution Approach 2:
The backup temperature measuring device functions as a cost-effective failover solution that can be simpler and more robust than the primary device. By designing the backup as a dedicated standby component rather than a full duplicate monitoring system, the patent reduces overall system cost while maintaining productivity through failover capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures continuous heating operations and prevents process interruptions, enhancing wafer yield and maintaining process continuity by utilizing redundant temperature measurement and control mechanisms.
Implementation Method 1
heating devices installed on pipelines to heat the process gases transported into process chambers
Implementation Method 2
temperature control thermocouples, which regulate the heating of the heating devices based on feedbacks of temperatures measured by the thermocouples
Data Source
AI summary
A pipeline temperature control equipment includes a processing device and multiple heating assemblies distributed along an extension direction of the temperature-controlled pipeline. Each heating assembly includes a heating device, a first temperature measuring device, a second temperature measuring device, and a control device. The first temperature measuring device and the second temperature measuring device in each heating assembly are used to measure a real-time temperature of the temperature-controlled pipeline, and are all connected to the control device in the heating assembly. Multiple control devices are connected to the processing device, and the processing device can, based on a measured value of the first temperature measuring device or the second temperature measuring device in each heating assembly, through the multiple control devices, control the multiple heating devices to work respectively until the multiple heated parts meet their respective target temperatures.