Composite Wrap Pipeline Repair Using Diode Laser Curing
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Solution Overview
Problem
Existing composite wrap repair methods for metal pipelines are hindered by lengthy curing processes, high processing costs, and the risk of thermal residual stresses due to inadequate temperature control during the curing of interlayer adhesives.
Innovation Solution
The method involves applying a composite wrap on a defect section of a metal pipe, followed by the application of a wet-out resin layer, which is then partially cured using a diode laser. The diode laser provides controlled heat, allowing for faster and more uniform curing, with adjustable temperature and power settings to optimize the curing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external heating tools such as heated sleeves or blankets are used to cure the adhesive, then the adhesive can be cured, but the processing time becomes several hours and costs increase
Solution Approach 1:
The patent replaces traditional mechanical heating systems (heated sleeves, blankets) with a diode laser system that uses optical energy to directly cure the adhesive. The laser provides concentrated energy at the adhesive location, enabling rapid curing without the thermal mass and slow heat transfer characteristic of conventional heating tools, thus reducing processing time from several hours to minutes while maintaining reliable adhesive curing
Solution Approach 2:
The patent changes the energy delivery parameter from diffuse thermal conduction (heated sleeves/blankets) to concentrated optical energy (diode laser). The laser wavelength is selected to match the absorption maximum of the wet-out resin, enabling direct energy absorption and rapid curing. This parameter change allows curing at optimal temperature without the thermal lag and heat loss inherent in conventional heating methods
2Productivity
If high cure temperatures are used to speed up curing, then processing time is reduced, but thermal residual stresses are induced
Solution Approach 1:
The diode laser provides highly localized heating only at the adhesive layer where curing is needed, rather than heating the entire pipeline or large surrounding areas. This localized energy delivery achieves rapid curing speed while minimizing the overall thermal input to the system, thereby reducing thermal gradients and residual stresses in the pipeline structure
Solution Approach 2:
The patent replaces conventional thermal conduction heating with direct optical energy absorption. The laser wavelength is specifically selected to match the absorption maximum of the wet-out resin, enabling direct and efficient energy conversion to chemical bonding without excessive thermal diffusion. This substitution allows rapid curing at controlled temperatures, avoiding the thermal runaway and excessive heat accumulation that cause residual stresses
3Object-affected harmful factors
If low cure temperatures are used to avoid thermal stresses, then thermal residual stresses are minimized, but the adhesive may not fully cure
Solution Approach 1:
The patent changes the energy delivery method from diffuse thermal conduction to concentrated optical energy absorption. By selecting a laser wavelength that matches the absorption maximum of the wet-out resin, the system achieves highly efficient energy transfer directly to the adhesive molecules. This enables complete curing at lower overall temperatures because the energy is concentrated exactly where needed, avoiding the thermal diffusion losses that require higher temperatures for complete curing in conventional methods
Solution Approach 2:
The laser curing process can be applied in controlled passes or pulses, allowing progressive curing of the adhesive layer. This periodic or staged energy delivery ensures complete curing throughout the adhesive thickness while maintaining temperature control, preventing both incomplete curing and excessive thermal stress accumulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces curing time and costs while minimizing thermal residual stresses, ensuring a fully cured composite system with enhanced mechanical, thermal, and chemical properties.
Implementation Method 1
curing using a diode laser
Implementation Method 2
The diode laser provides controlled heat, allowing for faster and more uniform curing
Implementation Method 3
The wavelength of the diode laser is about the same wavelength as an absorption maximum of the wet-out resin
Data Source
AI summary
Provided are systems and methods for repairing defects in metal pipes using a composite wrap repair system with diode laser curing.