Pitch-Based Carbon Fiber Stitched Composite Thermal Conductivity
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Solution Overview
Problem
Existing carbon fiber reinforced plastics, particularly those based on PAN and PITCH, face challenges in achieving high thermal conductivity while maintaining structural strength, especially in rapidly changing temperature environments like space applications.
Innovation Solution
A highly thermally conductive composite material is developed by stitching PITCH-based carbon fibers into a prepreg laminate, where the fibers penetrate in the lamination direction with both ends protruding and bent towards the surface of the laminate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If PAN-based carbon fiber reinforced plastic is used, then strength and modulus are improved, but thermal conductivity deteriorates
Solution Approach 1:
The invention uses a composite structure combining PAN-based carbon fiber (for strength) and PITCH-based carbon fiber (for thermal conductivity) in a stitched configuration. The PITCH-based carbon fiber is stitched through the PAN-based carbon fiber prepreg laminate, creating a hybrid composite that leverages the complementary properties of both materials to achieve both high strength and high thermal conductivity.
2Temperature
If PITCH-based carbon fiber reinforced plastic is used, then thermal conductivity and strength are improved, but cost increases
Solution Approach 1:
The invention applies PITCH-based carbon fiber only in the form of stitch threads where thermal conductivity is most needed (through-thickness direction), rather than using it for the entire fabric. This localized application reduces the overall amount of expensive PITCH-based carbon fiber required while still achieving the desired thermal conductivity enhancement in critical areas.
3Strength
If carbon fiber prepreg laminate is used, then structural strength is improved, but through-thickness thermal conductivity deteriorates
Solution Approach 1:
The PITCH-based carbon fiber stitch acts as an intermediary thermal conduction path through the laminate thickness. Since PITCH-based carbon fiber has superior thermal conductivity, it serves as a thermal bridge or mediator that conducts heat efficiently through the thickness direction, overcoming the inherent thermal insulation provided by the resin matrix and PAN-based carbon fiber orientation.
4Temperature
If high thermal conductivity is achieved, then heat dissipation is improved, but structural integrity may deteriorate
Solution Approach 1:
The invention merges the structural function (provided by PAN-based carbon fiber prepreg) and the thermal management function (provided by PITCH-based carbon fiber stitch) into a single integrated composite structure. The stitch not only provides thermal conduction paths but also acts as a mechanical reinforcement, simultaneously improving both heat dissipation and structural integrity rather than compromising one for the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This composite material exhibits enhanced through-thickness and in-plane thermal conductivity, as well as improved strength, making it suitable for applications requiring efficient heat dissipation and structural integrity.
Implementation Method 1
a plurality of PITCH-based carbon fibers penetrating the prepreg laminate in the lamination direction to have both ends protruding
Implementation Method 2
heating and curing the stitched prepreg laminate
Data Source
AI summary
The present disclosure relates to a highly thermally conductive composite material in which PITCH-based carbon fiber is stitched into a prepreg laminate in which a prepreg including carbon fiber and a thermosetting resin is laminated, and a method for manufacturing the same, and the highly thermally conductive composite material may have excellent through-thickness thermal conductivity, in-plane thermal conductivity and strength.


