Pivotable Machining Unit for Substrate Orientation Compensation
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Solution Overview
Problem
Existing surface processing devices face challenges in achieving precise and cost-effective surface processing of substrates, particularly when miniaturizing components with increasing performance, due to the need for exact alignment of substrates on the carrier, which is time-consuming and costly, and results in quality losses from positional deviations, especially when processing multiple substrates simultaneously.
Innovation Solution
A surface processing device with a processing unit adjustable along orthogonal axes, controlled by a position detection unit and control unit, allowing for precise positioning and movement of the processing unit relative to the substrate carrier, enabling flexible and accurate surface processing without the need for exact substrate alignment, and incorporating a revolving conveyor belt for optimal positioning and a pivotable processing unit for handling non-vertical substrate areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate carrier is made movable relative to the treatment unit, then the treatment quality can be improved, but the device occupies significantly more installation space
Solution Approach 1:
Instead of moving the substrate carrier relative to the treatment unit, the patent inverts the approach by making the treatment unit movable relative to the stationary substrate carrier. This allows the treatment unit to be positioned precisely over substrates at different locations without requiring the entire carrier to move, thereby achieving high treatment quality while minimizing installation space requirements.
Solution Approach 2:
The treatment unit is divided into multiple independent treatment heads that can be selectively positioned over different substrates. This segmentation allows the system to process multiple substrates simultaneously or sequentially without moving the entire carrier, reducing the space required while maintaining treatment quality.
2Manufacturing precision
If the substrate must be aligned in a precisely predetermined manner, then the surface finish quality can be improved, but the manufacturing time and cost increase significantly
Solution Approach 1:
The treatment unit is equipped with sensors and control systems that automatically detect the position and orientation of substrates on the carrier. The system then self-adjusts the treatment parameters and positioning without requiring manual alignment, achieving high surface finish quality while eliminating time-consuming alignment procedures.
Solution Approach 2:
The system dynamically adjusts treatment parameters such as positioning coordinates, movement speed, and treatment intensity based on real-time detection of substrate positions. This allows the system to accommodate substrates in various positions without precise predetermined alignment, reducing both alignment time and manufacturing costs while maintaining high surface finish quality.
3Device complexity
If the treatment unit has limited adjustability, then the device complexity is reduced, but the treatment quality does not meet requirements
Solution Approach 1:
The treatment unit is designed with dynamic adjustability, allowing it to be repositioned along multiple axes (X, Y, Z) and rotated to various orientations. This dynamic capability enables the treatment unit to adapt to substrates at different positions and angles, achieving high treatment quality without requiring an overly complex fixed-adjustment system.
Solution Approach 2:
The treatment unit is designed as a multi-functional system that can perform various treatment operations (cutting, drilling, polishing, etc.) on substrates of different types and orientations. This universal design achieves high treatment quality across diverse applications without requiring separate specialized equipment for each function, balancing adjustability with device complexity.
Data Source
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AI summary
The invention relates to a surface machining device comprising a substrate support for receiving a substrate to be machined, a machining unit which can be moved relative to the substrate support along a first and a second movement axis, a position detecting unit for ascertaining the orientation of the substrate, and a control unit for controlling the movement of the machining unit dependent on the orientation of the substrate on the substrate support. The aim of the invention is to provide a surface machining device which can be produced in a compact manner and which allows a precise machining of the surface of the substrate to be machined in an inexpensive manner regardless of the position of the substrate on the substrate support. This is achieved in that the machining unit can be pivoted relative to the substrate support, in particular about a height axis which extends perpendicularly to the plane formed by the first and second movement axis.