Pivotable Reflector Assembly for Semiconductor Deposition Uniformity
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Solution Overview
Problem
Existing semiconductor processing chambers face challenges in achieving uniform temperature control and deposition uniformity, leading to non-uniform film thickness across substrates, which is difficult to adjust and often requires chamber opening and downtime.
Innovation Solution
The implementation of pivotable reflector assemblies in the processing chamber, combined with a radiation source, allows for precise control of radiation distribution to adjust and correct temperature and deposition uniformity, using sensors and a controller to monitor and adjust parameters in real-time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional heating sources are used with fixed positioning, then the chamber structure is simple, but temperature uniformity across the substrate is poor leading to non-uniform deposition
Solution Approach 1:
The patent implements a pivotable reflector assembly that can dynamically adjust the position and orientation of the radiation source relative to the substrate. This dynamic positioning allows the heating system to adapt to different substrate positions and correct temperature non-uniformities in real-time, thereby improving deposition uniformity without requiring a completely complex heating system architecture
Solution Approach 2:
The reflector assembly is designed to concentrate radiation at specific target locations on the substrate by adjusting the reflector's angle. This allows localized heating control where radiation can be directed precisely to areas requiring temperature correction, improving overall temperature uniformity while maintaining system simplicity
2Manufacturing precision
If parameters such as temperature are adjusted to correct deposition non-uniformities, then deposition uniformity improves, but chamber opening and machine downtime are required
Solution Approach 1:
The system incorporates sensors that continuously monitor temperature distribution across the substrate and automatically control the reflector assembly to correct non-uniformities. This self-regulating capability allows the system to maintain optimal temperature uniformity during operation without requiring manual intervention, chamber opening, or machine downtime for adjustments
Solution Approach 2:
The patent implements a feedback control system where sensors detect temperature variations and this information is used to automatically adjust the reflector assembly's position. This closed-loop control enables real-time correction of temperature non-uniformities during the deposition process, eliminating the need for downtime adjustments
3Manufacturing precision
If a pivotable reflector assembly with sensors and controller is implemented, then temperature and deposition uniformity are improved, but the device complexity increases
Solution Approach 1:
The pivotable reflector assembly serves multiple functions: it directs radiation to specific target locations, adjusts the distribution of heat across the substrate, and works with the sensor system to maintain temperature uniformity. By consolidating these functions into a single multi-functional component, the system achieves improved temperature control precision without proportionally increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances deposition uniformity by correcting non-uniformities and reducing particle contamination, while minimizing chamber downtime through adaptive heating control.
Implementation Method 1
a radiation source oriented to emit radiation toward the reflector
Implementation Method 2
The polygonal reflector is oriented to reflect the radiation to a target location in the processing volume
Implementation Method 3
The polygonal reflector is pivotable to move the target location
Data Source
AI summary
The present disclosure relates to reflector assemblies for substrate processing adjustability in semiconductor manufacturing, and related process chambers, methods, and systems. In one or more embodiments, a process chamber includes a chamber body at least partially defining a processing volume, a substrate support disposed in the processing volume, and a heat assembly disposed outwardly of the processing volume. The heat assembly is operable to direct radiation to a target location in the processing volume. The heat assembly includes a reflector pivotable relative to an axis to move the target location and scan the radiation, and a radiation source oriented to emit radiation toward the reflector.