Pivoting Memory Expansion Assembly for Compact Motherboard Integration
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Solution Overview
Problem
The challenge is to increase the number of memory slots on a motherboard without expanding its area, which is essential for enhancing computing performance while maintaining a compact computer design.
Innovation Solution
A memory expansion assembly comprising two pivotally connected plates with electrical slots, allowing the plates to fold together for compact insertion into motherboard slots and unfold for memory insertion, effectively increasing memory capacity within a limited space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of memory slots is increased to expand memory capacity, then computing performance is improved, but the area of the motherboard increases
Solution Approach 1:
The patent applies dimensionality change by transforming the traditional planar arrangement of memory slots into a three-dimensional folded structure. The memory expansion assembly uses two plates connected by a hinge, allowing the plates to fold relative to each other and create vertical space utilization. This enables multiple memory slots to be arranged in a compact folded configuration that fits within the limited motherboard area while providing sufficient space for multiple memory modules.
Solution Approach 2:
The patent implements nesting by placing one plate within the spatial envelope of another when folded. The first and second plates are arranged such that when folded, they occupy overlapping or adjacent spatial regions, maximizing the use of vertical space. This nested arrangement allows the memory expansion assembly to fit into a compact footprint on the motherboard while still accommodating multiple memory slots across the folded plates.
2Quantity of substance
If the number of memory slots is increased without increasing motherboard area, then memory capacity is expanded, but spaces for other electronic components are occupied
Solution Approach 1:
By transitioning from a two-dimensional planar layout to a three-dimensional folded structure, the patent creates additional spatial layers for memory slot arrangement. The hinge-connected plates can be folded to utilize vertical space above and below the motherboard plane, effectively adding memory capacity without encroaching on the horizontal space required for other electronic components.
Solution Approach 2:
The patent employs a dynamic folded structure with hinge connections that allow the plates to be adjusted between folded and unfolded states. This dynamic capability enables flexible space management - when folded, the assembly occupies minimal space for installation; when unfolded, it provides adequate space for inserting and removing memory modules without interfering with other components.
3Area of stationary object
If a folded structure is used to reduce insertion area, then compactness is achieved, but the complexity of the structure increases
Solution Approach 1:
The patent divides the memory expansion assembly into segmented components: a first plate, a second plate, and a hinge connection. This segmentation allows each component to be independently manufactured and assembled, simplifying production despite the folded configuration. The modular segmented structure also facilitates easy installation and removal of memory modules while maintaining the compact folded form factor.
Solution Approach 2:
The patent merges multiple functional elements into a unified folded assembly. The first plate, second plate, hinge connection, and electrical connecting portions are combined into a single integrated memory expansion assembly that can be installed as one unit. This merging reduces the overall complexity of installation and assembly while achieving the compact folded structure needed for space efficiency.
Data Source
AI summary
A memory expansion assembly includes a first plate having first electrical slots and a first electrically connecting portion, a second plate pivotally connected to the first plate and having second electrical slots and a second electrically connecting portion, a first engaging assembly, and a second engaging assembly. The first electrical slots are electrically connected to the first electrically connecting portion. The second electrical slots are electrically connected to the second electrically connecting portion. The second plate is adapted to pivot relative to the first plate to have a folded position when the two are close to each other and an unfolded position when the two are away from each other. The first engaging assembly is disposed on a side of the first plate. The second engaging assembly is disposed on a side of the second plate. The first engaging assembly is removably engaged with the second engaging assembly.