Pivoting Transfer Tools for Semiconductor Chip Placement
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Solution Overview
Problem
Modern die bonder systems face challenges in overcoming height differences between the chip supply and substrate planes with existing machinery, which results in increased complexity, space requirements, and reduced throughput, while also struggling to handle both flip-chip and non-flip applications efficiently with high accuracy and flexibility.
Innovation Solution
The method employs a series of pivoting tools to transfer semiconductor chips between the supply station and substrate plane using multiple curve movements, allowing for compact machine design and efficient chip placement by the same bearing side, enabling both flip-chip and non-flip applications with improved accuracy and throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single rotatable pick tool is used to overcome height difference between pick plane and delivery plane, then the height difference can be bridged, but the external diameter of the tool becomes relatively large which is not advantageous for space reasons and kinematics
Solution Approach 1:
The patent divides the single large rotatable pick tool into multiple smaller pivoting tools (first pivoting tool, second pivoting tool, third pivoting tool). Each tool handles a portion of the height difference through separate pivoting movements, eliminating the need for one large-diameter tool and reducing the machine's footprint while maintaining the capability to bridge the height difference between pick and delivery planes.
2Adaptability or versatility
If the chip is always turned by the transfer operation, then it is deposited onto the substrate by its structure side (flip-chip application), but the same bearing side cannot be deposited which limits application flexibility
Solution Approach 1:
The patent implements a dynamic transfer system where the pivoting tools can adjust their movement sequences based on the required application type. For non-flip applications, the chip is transferred without turning, depositing the bearing side. For flip-chip applications, the chip is turned during transfer, depositing the structure side. This dynamic adaptability allows the same apparatus to handle both application types with high precision.
3Adaptability or versatility
If the machine is designed to handle both flip-chip and non-flip applications, then the range of use is broadened, but the structural height and machine layout plan increase
Solution Approach 1:
The patent designs a universal transfer system using multiple pivoting tools that can perform both flip-chip and non-flip applications. The same first, second, and third pivoting tools are used for both application types by adjusting the transfer sequences, eliminating the need for separate dedicated tools for each application type and thereby controlling the structural height and machine layout.
4Area of stationary object
If multiple separate pivoting tools are used to cover curve movements, then space can be saved and energy outlay reduced, but the device complexity increases
Solution Approach 1:
The patent combines multiple pivoting tools (first, second, and third pivoting tools) into a coordinated transfer system. While each tool performs a simple pivoting movement, their coordinated action through controlled sequences achieves the complex task of transferring chips between planes and orientations. This merging approach reduces the overall machine footprint while managing complexity through systematic control of the multiple tools.
Data Source
AI summary
An apparatus for the placement of a semiconductor chip on a substrate is provided. The apparatus includes: (a) a supply station adapted to include a semiconductor wafer in a substantially horizontal position, the semiconductor wafer including the semiconductor chip; (b) a placement station positioned entirely above the supply station, the placement station being adapted to support the substrate; and (c) a transport apparatus entirely above the supply station, the transport apparatus moving the semiconductor chip from the semiconductor wafer to the substrate, the transport apparatus including (1) a pivoting pick-up tool that removes the semiconductor chip from the semiconductor wafer, the pivoting pick-up tool being arranged on a rotary arm, the rotary arm rotates about a horizontal axis to raise the semiconductor chip to a transfer position entirely above the semiconductor wafer through an ascending curved movement, (2) a placement tool that moves the semiconductor chip to the placement station and bonds the semiconductor chip on the substrate at the placement station, and (3) at least one pivoting transfer tool that transfers the semiconductor chip from the pivoting pick-up tool to the placement tool, each of the at least one pivoting transfer tool being arranged on a respective rotary arm to rotate about a respective horizontal axis to raise the semiconductor chip along a respective ascending curved movement.