Pivoting Semiconductor Wafer Container with Integral Pin Lock

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Solution Overview

Problem

In semiconductor fabrication, there is a need for containers that maintain a clean room climate for storing and transporting semiconductor wafers, which must be tightly sealed to prevent contamination and accommodate larger wafers with smaller device sizes, while ensuring the safety of sensitive semiconductor elements.

Innovation Solution

A container apparatus comprising two pivotally connected body portions with integral pin holders and pivotal pin structures, made from a polymer composition like polycarbonate, which provides antistatic properties and includes a storage medium for wireless communication devices like RFID for tracking and a gel pad for secure storage, ensuring minimal contamination and mechanical shock resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the container is made tightly sealed to prevent contamination, then the cleanliness of semiconductor wafers is improved, but the device complexity increases

Engineering Contradiction:
Improvecontamination preventionVSAvoidcontainer structure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The container is divided into a lid portion and a base portion that can be separately assembled and disassembled. This segmentation allows for simpler individual components while achieving tight sealing when combined, resolving the contradiction between contamination prevention and structural complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sealing function is merged with the structural components by integrating sealing ribs and grooves directly into the lid and base portions. This combination eliminates the need for separate sealing mechanisms, reducing overall complexity while maintaining effective contamination prevention.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If the container size is increased to accommodate larger wafers, then the adaptability is improved, but the stability of the container increases

Engineering Contradiction:
Improvewafer size accommodationVSAvoidcontainer structural stability
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The container is segmented into modular lid and base portions that can be configured in different orientations and combinations. This modularity allows the container to adapt to various wafer sizes while maintaining structural stability through standardized connection interfaces.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The lid and base portions are designed with universal sealing interfaces and attachment mechanisms that work across different container configurations. This universality enables the same components to accommodate various wafer sizes while maintaining consistent structural stability through standardized design elements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively maintains a clean environment for semiconductor wafers, prevents contamination, and withstands mechanical shocks, ensuring the integrity of the semiconductor elements during storage and transport while allowing for easy identification and tracking.

Implementation Method 1

made from a polymer composition like polycarbonate, which provides antistatic properties

Methodology Applied
Scientific EffectAntistatic properties: Electrostatics

Implementation Method 2

two pivotally connected body portions with integral pin holders and pivotal pin structures

Methodology Applied
Scientific EffectPivotal rotation: Hinge

Implementation Method 3

a gel pad for secure storage, ensuring minimal contamination and mechanical shock resistance

Methodology Applied
Scientific EffectShock absorption: Gel

Data Source

PatentUS11195737B2Apparatus for storing and transporting semiconductor elements, and method of making the same
Publication Date: 2021.12.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US11195737B2 patent drawing
  • US11195737B2 patent drawing
  • US11195737B2 patent drawing

AI summary

An apparatus for storing and transporting semiconductor elements includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pin holder integrally extending from the first rear side wall. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pivotal pin structure integrally coupled with and extending from the second rear side wall. The at least one pivotal pin structure comprises a shaft, and a head connected with the shaft. The at least one pin holder defines a cavity sized and shaped to accept the head of the at least one pivotal pin structure. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.