Pixel Array Substrate Jumper Wire Bridge Structure
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Solution Overview
Problem
The dense distribution of vertical signal lines in display device circuit designs increases the risk of short circuits and line defects due to foreign matters during manufacturing, affecting the yield and quality of pixel array substrates.
Innovation Solution
A pixel array substrate design incorporating a jumper wire bridge structure, where the first and third signal lines are on the same film layer and the second signal line is on a different layer, with ends connected via contact windows, reducing the likelihood of short circuits by increasing spacing between adjacent lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If vertical selection lines are arranged densely in the display region to reduce side frame width, then the display area is increased, but the risk of short circuit and line defects increases due to foreign matters
Solution Approach 1:
The patent applies dimensionality change by transitioning from a planar single-layer layout to a three-dimensional multi-layer structure. The first and third signal lines are positioned on different film layers (first film layer and second film layer respectively), with the second signal line on an intermediate layer. This vertical stacking in the third dimension allows dense horizontal routing while maintaining adequate spacing between adjacent lines through layer separation, thereby preventing short circuits while maximizing display area.
Solution Approach 2:
The patent introduces an intermediary structure - the insulating layer - positioned between the first/third signal lines (on first film layer) and the second signal line (on second film layer). This insulating layer acts as a mediator that electrically isolates adjacent signal lines while allowing them to be in close proximity, thus enabling dense routing without causing short circuits due to foreign matters or manufacturing variations.
2Reliability
If the spacing between adjacent signal lines is increased to prevent short circuits, then the reliability is improved, but the display area is reduced
Solution Approach 1:
Instead of increasing horizontal spacing between signal lines, the patent utilizes the vertical dimension by arranging signal lines on multiple film layers. The first signal line and third signal line are on the first film layer, while the second signal line is on the second film layer. This vertical separation allows the lines to be closely spaced horizontally without risking short circuits, as the insulating layer provides electrical isolation in the vertical direction, thereby maintaining high display area while ensuring reliability.
3Ease of manufacture
If multiple signal lines are arranged on the same film layer to simplify manufacturing, then the manufacturing process is simplified, but the risk of foreign matter-induced short circuits increases
Solution Approach 1:
The patent distributes signal lines across multiple film layers (first film layer for first and third signal lines, second film layer for second signal line) rather than concentrating them all on a single layer. This vertical separation in the third dimension reduces the sensitivity to foreign matters on any single layer, as foreign particles are less likely to cause short circuits between lines on different layers. The insulating layer between film layers provides additional protection, maintaining manufacturing feasibility while reducing foreign matter-induced defects.
4Reliability
If the jumper wire bridge structure with multiple layers is implemented to prevent short circuits, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The jumper wire bridge structure utilizes the vertical dimension by routing signal lines through multiple film layers. The first and third signal lines on the first film layer connect to the second signal line on the second film layer through vertical transitions. This approach, while appearing more complex, actually simplifies the overall routing logic compared to trying to achieve the same functionality through complex planar routing on a single layer, as it naturally provides isolation and reduces short circuit risks.
Solution Approach 2:
The insulating layer serves as an intermediary structure that facilitates the multi-layer jumper wire bridge configuration. By providing electrical isolation between the first/third signal lines and the second signal line, the insulating layer enables the complex multi-layer routing to function reliably without requiring additional complex shielding or isolation structures, thus managing device complexity while maintaining high reliability.
Data Source
AI summary
A pixel array substrate including a substrate, first signal lines, second signal lines, third signal lines, and active devices is provided. The first signal lines, the second signal lines, the third signal lines, and the active devices are disposed on the substrate. Each of the first signal lines has a jumper wire bridge structure which includes a first line and a second line disposed on the same film layer, and a third line disposed on another film layer. The second signal lines intersect the first signal lines and the third signal lines. Each of the second signal lines is electrically connected to one of the first signal lines. Each active device is electrically connected to one second signal line and one third signal line.