Pixel Array Substrate Sacrificial Layer for Corrosion-Free Etching
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Solution Overview
Problem
Current pixel array substrates face issues of metal corrosion and photoresist residue due to etching gases remaining on circuit structures, and high-power plasma treatment can fail to completely remove the photoresist pattern.
Innovation Solution
A sacrificial layer is introduced between the substrate and the metal stack layer, which is etched simultaneously with the metal stack layer, reducing residual etching gases and enhancing the plasma treatment process to avoid corrosion and residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-power plasma is used to treat the surface of circuit structures, then metal corrosion is avoided, but photoresist residues remain on the circuit structure
Solution Approach 1:
A sacrificial layer is formed on the substrate before forming the metal stack layer. This sacrificial layer is etched simultaneously with the metal stack layer during the dry etching process, creating protruding patterns that prevent etching gas adhesion before the plasma treatment step, thereby preparing the surface in advance to avoid both metal corrosion and photoresist residue
2Ease of manufacture
If dry etching process is used to remove metal stack layer, then circuit structures are formed, but etching gases remain on the surface causing metal corrosion
Solution Approach 1:
The sacrificial layer acts as an intermediary between the substrate and the metal stack layer. During dry etching, it is removed simultaneously with the metal stack layer to form protruding patterns that serve as a mediator to prevent etching gas adhesion on the circuit structures, thereby solving the metal corrosion problem while maintaining ease of manufacture
3Reliability
If sacrificial layer is added between substrate and metal stack layer, then etching gas residue is reduced, but process complexity increases
Solution Approach 1:
The formation of the sacrificial layer is merged with the existing manufacturing process flow. The sacrificial layer is formed using the same deposition processes as the metal stack layer, and both are etched simultaneously in a single dry etching step, combining multiple functions into unified process steps to minimize additional complexity while achieving effective etching gas removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves process yield and reliability by minimizing metal corrosion and photoresist residue, ensuring effective removal of etching gases and maintaining the integrity of circuit structures.
Implementation Method 1
using a dry etching process to remove part of the metal stack layer and part of the sacrificial layer
Implementation Method 2
performing a plasma treatment process on surfaces of the gate lines and the protruding patterns using a reactive gas
Data Source
AI summary
A manufacturing method of a pixel array substrate is provided. The manufacturing method of the pixel array substrate includes forming a sacrificial layer on a substrate, forming a metal stack layer on the sacrificial layer, using a dry etching process to remove part of the metal stack layer and part of the sacrificial layer and forming a plurality of gate lines and a plurality of protruding patterns, and performing a plasma treatment process on surfaces of the gate lines and the protruding patterns using a reactive gas. The metal stack layer includes a first titanium layer, an aluminum layer and a second titanium layer. The protruding patterns are respectively aligned with the gate lines. A pixel array substrate produced by using the manufacturing method of the pixel array substrate is also provided.