Pixel Array Substrate Read-Out Circuit Placement for In-Cell Fingerprint
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Solution Overview
Problem
In in-cell fingerprint panels, the read-out circuit occupies the outer lead bonding region, adversely affecting the screen-to-body ratio of the display panel, as sensing signals from sensing pixels need to be transmitted to an external processing circuit.
Innovation Solution
A pixel array substrate design with a substrate divided into regions, where display pixels are on one region and sensing pixels on another, with a read-out circuit portion located between display pixels on a second region, allowing for efficient signal transmission without occupying the outer lead bonding area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the read-out circuit is placed in the outer lead bonding region to transmit sensing signals, then the sensing signal transmission is enabled, but the screen-to-body ratio is reduced
Solution Approach 1:
The read-out circuit is moved from the traditional outer lead bonding region (2D plane at the edge) to the inner region between display pixels (utilizing the third dimension of pixel arrangement space). This dimensional repositioning allows the read-out circuit to occupy non-display pixel spaces rather than reducing the display area, thereby maintaining screen-to-body ratio while enabling sensing signal transmission.
Solution Approach 2:
The read-out circuit is nested within the pixel array structure by placing it between display pixels in the second region. This nesting approach allows the read-out circuit to be integrated into the existing pixel architecture without requiring additional external space, effectively hiding the circuit within the display panel's internal structure.
2Adaptability or versatility
If sensing pixels are integrated into the pixel array substrate for in-cell fingerprint recognition, then full-screen fingerprint recognition is achieved, but the read-out circuit occupies the outer lead bonding region
Solution Approach 1:
The read-out circuit is repositioned from the edge-based outer lead bonding region to the interior space between display pixels. This spatial reconfiguration allows the circuit to be embedded within the pixel array's internal structure, freeing up the outer lead bonding region while maintaining full-screen fingerprint recognition capability through the integrated sensing pixels.
Solution Approach 2:
The pixel array substrate is designed to serve multiple functions: display pixels for visual output, sensing pixels for fingerprint recognition, and the read-out circuit for signal processing - all integrated within the same substrate area. The read-out circuit positioned between display pixels enables it to serve as both a display structure and a signal transmission pathway, eliminating the need for separate outer lead bonding region occupation.
Data Source
AI summary
A pixel array substrate including a substrate, a plurality of display pixels, a plurality of sensing pixels, and a read-out circuit is provided. The substrate includes a first region and a second region. The second region is located between the first region and an edge of the substrate. The display pixels are disposed on the first region and the second region of the substrate. The sensing pixels are disposed on the first region of the substrate. The read-out circuit is electrically connected to the sensing pixels. A portion of the read-out circuit is disposed on the second region of the substrate and the portion of the read-out circuit is located between two display pixels of the display pixels.