Pixel Array Layout for Combined ToF Depth and Color Sensing
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Solution Overview
Problem
Existing systems cannot simultaneously generate a 3D image that provides both distance and color information of objects in an area, as Time-of-Flight sensors only provide distance data while CMOS image sensors only provide color data, lacking integration of both in a single image.
Innovation Solution
A pixel array is developed that combines Time-of-Flight sensors and CMOS image sensors, where the outputs from both types of sensors are integrated to generate a 3D ToF color image, enabling the determination of both distance and color information by pairing ToF sensors with CMOS image sensors in a semiconductor substrate, with isolation regions to reduce cross-talk and enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a pixel array uses only CMOS image sensors, then color information can be captured, but distance information cannot be obtained
Solution Approach 1:
The patent combines ToF sensors and CMOS image sensors into a single pixel array, allowing both distance and color information to be captured simultaneously. Each ToF sensor element is paired with corresponding CMOS pixel elements, creating an integrated sensing system that outputs combined depth and color data without requiring separate sensor arrays.
Solution Approach 2:
The pixel array is designed to perform multiple functions: ToF sensors capture distance information through phase detection, while CMOS sensors capture color information through color filters. The unified array structure enables both depth mapping and color imaging capabilities within a single device, eliminating the need for separate sensors.
2Loss of information
If a pixel array uses only ToF sensors, then distance information can be captured, but color information cannot be obtained
Solution Approach 1:
The patent integrates ToF sensors and CMOS image sensors in a unified pixel array where each ToF sensor element is spatially correlated with CMOS pixel elements. This merging allows the system to simultaneously acquire distance data from ToF sensors and color data from CMOS sensors with matching spatial resolution.
Solution Approach 2:
The dual-sensor pixel array provides multi-functional capability: ToF sensors detect phase shifts to determine distance, while adjacent CMOS sensors with color filters detect wavelength to determine color. This universal design enables a single device to perform both depth sensing and color imaging functions.
3Loss of information
If separate ToF sensors and image sensors are used, then both distance and color information can be obtained, but the system complexity increases
Solution Approach 1:
The patent merges separate ToF sensor arrays and CMOS image sensor arrays into a single integrated pixel array. The sensors are arranged in corresponding spatial positions, allowing synchronized capture of distance and color information from the same scene without requiring separate optical paths or complex calibration procedures.
Solution Approach 2:
The pixel array is segmented into ToF sensor elements and CMOS sensor elements, with each segment performing its specialized function. ToF elements detect phase-modulated light for distance measurement, while CMOS elements detect visible light for color imaging. This segmentation allows functional specialization while maintaining spatial correlation through the unified array structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration allows for the creation of a 3D ToF color image that effectively combines distance and color data, enhancing applications such as 3D module construction, virtual reality, augmented reality, and autonomous vehicles by providing comprehensive spatial information.
Implementation Method 1
Complementary metal oxide semiconductor (CMOS) image sensors utilize light-sensitive CMOS circuitry, referred to as pixel sensors, to convert light energy into electrical energy. A pixel sensor typically includes a photodiode formed in a silicon substrate. As the photodiode is exposed to light, an electrical charge is induced in the photodiode.
Implementation Method 2
Time-of-Flight (ToF) sensors (e.g., sensors that use germanium-on-silicon (GeSi) technology to enable ToF sensing) can be used in a system designed to detect distances to objects in an area. Generally, a given ToF sensor detects a phase difference between a signal transmitted by the system and a corresponding signal received by the given ToF sensor (after reflection of the signal by an object in the area). This phase difference can be used to determine the distance to the object that reflected the signal.
Data Source
AI summary
A pixel array may include a group of time-of-flight (ToF) sensors. The pixel array may include an image sensor comprising a group of pixel sensors. The image sensor may be arranged among the group of ToF sensors such that the image sensor is adjacent to each ToF sensor in the group of ToF sensors.