Pixel-Based Light Projection for Substrate Tuning
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Solution Overview
Problem
Current photolithography processes face challenges in achieving uniform critical dimensions and temperature control across semiconductor substrates, leading to non-uniformities and defects in patterned features.
Innovation Solution
A pixel-based light projection system using digital light processing (DLP) or grating light valve (GLV) technology is employed to spatially control light radiation on substrates, allowing for precise adjustment of critical dimensions and temperature, enabling fine-tuned heating and actinic radiation delivery to correct non-uniformities and enhance processing uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photolithography processes are used, then substrates can be processed, but critical dimension uniformity and temperature control are poor leading to non-uniformities and defects
Solution Approach 1:
The patent segments the heating and radiation control into spatially-resolved zones across the substrate surface. By dividing the substrate into multiple regions with independently controllable heating and radiation parameters, the system achieves precise critical dimension uniformity (within 1 nm) across different areas, resolving the contradiction between manufacturing precision and ease of manufacture.
Solution Approach 2:
The patent applies local quality by allowing different regions of the substrate to receive customized heating and actinic radiation parameters. Each region can be independently tuned to achieve optimal critical dimensions, addressing the non-uniformities that plague conventional uniform processing approaches and improving overall manufacturing precision.
2Temperature
If uniform heating and radiation are applied across the substrate, then processing is simple, but temperature control and critical dimension uniformity deteriorate
Solution Approach 1:
The patent implements dynamic spatial control where heating and radiation parameters can be adjusted independently for different regions of the substrate. This dynamic approach allows the system to compensate for thermal gradients and non-uniformities, achieving temperature uniformity across the substrate while managing device complexity through programmable control.
Solution Approach 2:
The patent employs feedback mechanisms to monitor and adjust temperature and radiation parameters across different substrate regions. By measuring actual temperature distributions and critical dimensions, the system can iteratively optimize heating and radiation parameters, achieving temperature uniformity while using feedback loops to manage control complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves critical dimension uniformity and reduces defectivity by providing precise control over baking processes, achieving uniformity within 1 nm and optimizing photolithographic patterning processes.
Implementation Method 1
A wavelength of 400-700 nm light, Ultra Violet Light (UV), infrared light, or any wavelength directed at an object can treat a substrate either by heating or providing actinic radiation
Implementation Method 2
exposing these films to a pattern of a actinic radiation to define a latent pattern within the film
Data Source
AI summary
Techniques herein include systems and methods that provide a spatially-controlled or pixel-based projection of light onto a substrate to tune various substrate properties. A given pixel-based image projected on to a substrate surface can be based on a substrate signature. The substrate signature can spatially represent non-uniformities across the surface of the substrate. Such non-uniformities can include energy, heat, critical dimensions, photolithographic exposure dosages, etc. Such pixel-based light projection can be used to tune various properties of substrates, including tuning of critical dimensions, heating uniformity, evaporative cooling, and generation of photo-sensitive agents. Combining such pixel-based light projection with photolithographic patterning processes and/or heating processes improves processing uniformity and decreases defectivity.