Color Conversion Pixel Cavities for Low-Temperature Display Assembly
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Solution Overview
Problem
Existing methods for manufacturing optoelectronic devices with color conversion modules require high-energy steps and temperatures above 200°C, which can degrade the optical conversion properties of materials like quantum dots, and involve complex alignment and positioning challenges during transfer and attachment to a support.
Innovation Solution
A method involving forming display pixel circuits with walls defining cavities, securing them to a support, and then filling the cavities with color conversion modules after transfer, using photolithography and inkjet printing to create photoluminescent blocks, which reduces exposure to high temperatures and simplifies alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If color conversion modules are formed before transferring display pixel circuits to the support, then alignment and positioning can be performed during manufacturing, but the modules are exposed to high temperatures above 200°C during transfer and attachment which degrades their optical conversion properties
Solution Approach 1:
The patent applies preliminary action by forming the walls defining the cavities before transferring the display pixel circuits to the support. This allows the structural framework to be prepared in advance, enabling precise alignment during the wall formation process while avoiding exposure of the color conversion modules to high temperatures. The modules are then filled into the pre-formed cavities at a later stage when temperature exposure is no longer an issue.
2Reliability
If color conversion modules are formed after transferring display pixel circuits to the support, then the modules are protected from high temperature exposure, but alignment and positioning become more complex
Solution Approach 1:
The patent resolves this contradiction by performing preliminary actions of forming the wall structures and defining the cavity positions before the color conversion modules are filled. This preliminary structuring establishes precise alignment references that guide the subsequent module filling process, ensuring manufacturing precision is maintained even when modules are formed after transfer.
3Strength
If high temperature steps above 200°C are used in the manufacturing process, then display pixel circuits can be securely attached to the support, but the optical conversion properties of color conversion modules degrade
Solution Approach 1:
The patent applies segmentation by separating the manufacturing process into distinct stages: first forming the wall structures and securing display pixel circuits to the support, then later filling the cavities with color conversion modules. This segmentation allows the attachment process to occur with appropriate temperature for strong bonding, while the temperature-sensitive color conversion modules are introduced in a separate, low-temperature stage, thus preserving their optical properties.
4Manufacturing precision
If walls are formed after transferring display pixel circuits to the support, then alignment errors from transfer are avoided, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent applies preliminary action by forming the walls and defining cavity positions before transferring the display pixel circuits to the support. This preliminary structuring establishes precise alignment references that guide the subsequent module filling process, ensuring manufacturing precision is maintained even when modules are formed after transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method preserves the optical properties of color conversion modules, reduces crosstalk between subpixels, and allows for flexible material selection and alignment, enabling efficient production of optoelectronic devices with improved performance.
Implementation Method 1
The photoluminescent block comprises phosphors or particles of at least one photoluminescent material configured, when excited by the light emitted by the associated light-emitting diode, to emit light at a wavelength different from the wavelength of the light emitted by the associated light-emitting diode
Data Source
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AI summary
The present application relates to a method for manufacturing an optoelectronic device comprising the following steps, in order: a) manufacturing display pixel circuits (12) each comprising an emission face (18), and on said face (18), walls (22) delimiting at least one cavity (24); b) fixing said display pixel circuits (12) to a support (30); and c) filling the at least one cavity (24) of each display pixel circuit (12) with a first filling material to form a first color conversion module (32) in said cavity (24). The present application also relates to a display screen (40) obtained by the manufacturing method detailed above.