Color Conversion Pixel Cavities for Quantum Dot Display Transfer
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Solution Overview
Problem
Existing methods of manufacturing optoelectronic devices with color conversion modules face challenges such as high-energy steps and temperatures that degrade the optical conversion properties of photoluminescent materials, particularly quantum dots, and require complex photolithography for wall formation due to potential misalignments during transfer.
Innovation Solution
A method involving forming display pixel circuits with walls and cavities on a semiconductor wafer, bonding to a support, and then filling cavities with color conversion modules after transfer, using photolithography for wall formation and inkjet printing for material filling, which avoids high temperatures and misalignments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If color conversion modules are formed before bonding display pixels to support, then manufacturing process is simplified, but optical conversion properties of photoluminescent materials degrade due to high temperatures
Solution Approach 1:
The patent applies preliminary action by forming the color conversion modules in advance on the display pixel circuits before bonding them to the support. This allows the photoluminescent materials to be prepared and positioned without exposure to high temperatures during the bonding process, thus preserving their optical conversion properties while simplifying the overall manufacturing process.
2Manufacturing precision
If walls are formed after transfer of display pixels, then alignment precision is improved, but manufacturing complexity increases due to additional photolithography steps
Solution Approach 1:
The patent applies preliminary action by forming the walls delimiting cavities on the display pixel circuits before transferring them to the support. This preliminary formation of walls ensures precise alignment is achieved during the initial circuit fabrication, and the walls remain in place during transfer, eliminating the need for additional post-transfer photolithography steps.
3Strength
If high temperature bonding is used to bond display pixels to support, then bonding strength is improved, but photoluminescent materials suffer thermal degradation
Solution Approach 1:
The patent applies segmentation by separating the bonding process from the color conversion module formation process. The display pixel circuits are bonded to the support first, and then the color conversion modules are formed in the cavities at lower temperatures. This segmentation allows strong bonding to be achieved without exposing the photoluminescent materials to high temperatures that would cause thermal degradation.
4Adaptability or versatility
If color conversion modules are formed before separation of display pixel circuits, then material selection flexibility is improved, but protection requirements increase due to exposure during subsequent steps
Solution Approach 1:
The patent applies preliminary action by forming the color conversion modules after the display pixel circuits are bonded to the support but before final device assembly. This timing allows maximum flexibility in material selection for the color conversion modules, as they can be chosen and applied without needing to withstand high-temperature bonding processes, while also eliminating the need for complex protection measures during subsequent manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach preserves the optical properties of quantum dots, simplifies wall formation, and allows for precise alignment, enabling efficient manufacturing of optoelectronic devices with reduced crosstalk and common processes for different types of displays.
Implementation Method 1
The photoluminescent block comprises luminophores or particles of at least one photoluminescent material configured, when they are excited by the light emitted by the associated light-emitting diode, to emit light at a wavelength different from the wavelength of the light emitted by the associated light-emitting diode
Data Source
AI summary
A method of manufacturing an optoelectronic device including the steps of manufacturing of the display pixel circuits, each comprising an emission surface, and on the surface, walls delimiting at least one cavity, of bonding of the display pixel circuits to a support, and of filling of the at least one cavity of each display pixel circuit with a first filling material to form a first color conversion module in the cavity.