Pixel Assembly Conductor Layout for Uniform Display Luminance
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Solution Overview
Problem
Existing display devices experience uneven luminance and color due to a decrease in supply voltage as it travels from the power supply terminal to the source electrodes of drive transistors, leading to lower image quality.
Innovation Solution
A pixel assembly with an insulating substrate, drive transistors, and light emitters, where the connection conductor layer has a surrounding or planar portion on the second surface, increasing the area and reducing electrical resistance, thus maintaining a consistent supply voltage to the source electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the connection conductor layer uses a conventional layout without surrounding portions, then the device complexity is low, but the supply voltage becomes uneven across different pixels leading to poor image quality
Solution Approach 1:
The connection conductor layer is segmented into multiple independent surrounding portions, each encircling individual light emitters. This segmentation allows each portion to independently maintain voltage levels for adjacent pixels, preventing voltage drops from propagating across the entire display and ensuring uniform luminance output.
Solution Approach 2:
The connection conductor layer transitions from a conventional linear or grid pattern to a two-dimensional surrounding structure that encircles light emitters. This dimensional change creates multiple voltage distribution paths and increases the conductor's effective area, reducing electrical resistance and improving voltage uniformity across the display.
2Manufacturing precision
If the connection conductor layer area is increased to reduce electrical resistance, then the voltage supply becomes more uniform, but the area occupied by conductors increases reducing the aperture ratio
Solution Approach 1:
The connection conductor layer is strategically positioned only in regions where voltage distribution is needed, specifically surrounding individual light emitters. This local placement ensures voltage uniformity is achieved where critical while minimizing the overall conductor area, as conductors are not wasted in regions where they would not contribute to performance.
Solution Approach 2:
The surrounding portions of the connection conductor layer create equipotential regions around each light emitter, ensuring that all pixels in the surrounding area receive consistent voltage. This equipotential design achieves voltage uniformity without requiring excessive conductor material, as the surrounding geometry efficiently distributes voltage locally.
3Reliability
If the connection conductor layer surrounds light emitters, then the supply voltage to source electrodes is stabilized, but the manufacturing process becomes more complex
Solution Approach 1:
The connection conductor layer is merged with the pixel electrode structure, forming an integrated design where the surrounding conductor portions serve dual functions as both connection pathways and pixel electrodes. This merging reduces the number of separate fabrication steps and simplifies the overall manufacturing process while maintaining voltage stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces uneven color and luminance in display images, enhancing the image quality by maintaining a stable voltage supply to the drive transistors.
Implementation Method 1
a connection conductor layer located on the insulating substrate and connecting the source electrode to the power feeder
Data Source
AI summary
A pixel assembly includes an insulating substrate including a first surface and a second surface on an opposite side to the first surface, a drive transistor located in the insulating substrate or on the first surface and including a source electrode and a drain electrode, a power feeder connectable to an external power supply, a connection conductor layer located on the insulating substrate and connecting the source electrode to the power feeder, and a light emitter located on the second surface and electrically connected to the drain electrode. The connection conductor layer includes a surrounding portion surrounding the light emitter in a plan view on the second surface.