Pixel Electrode Adhesion via Oxide-Metal Composite Layers

The patent employs a composite structure consisting of an inorganic insulating film layer, a metal conductive layer, and an organic insulating film layer. This multi-layer composite design combines materials with different properties: the inorganic insulating film provides adhesion and insulation, the metal layer provides electrical conductivity, and the organic insulating film provides additional insulation and protection. This composite structure resolves the contradiction by ensuring both good adhesion (through the inorganic film) and high conductivity (through the metal layer).

The inorganic insulating film acts as an intermediary layer between the substrate and the metal conductive layer. This intermediary layer prevents direct contact between the metal and substrate, eliminating the adhesion problem while maintaining electrical conductivity through the metal layer. The inorganic insulating film mediates the interaction between the substrate and metal, solving the adhesion-conductivity contradiction.

The patent extracts and removes the problematic Ag remainers and etching residues from the system. By using the multi-layer structure with inorganic insulating film and organic insulating film, any Ag remainers generated during mixed acid etching are isolated and prevented from causing short-circuits. The etching residues are also managed through the layered structure, allowing for precise patterning without the harmful effects of incomplete etching.

The inorganic insulating film and organic insulating film are deposited beforehand to create a protective structure that cushions against the harmful effects of etching residues and Ag remainers. This prior cushioning ensures that even if etching is incomplete or residues remain, the device will not experience short-circuiting, thus maintaining high manufacturing precision without the detrimental effects of residues.

The multi-layer composite structure (inorganic insulating film + metal conductive layer + organic insulating film) provides multiple barriers that prevent short-circuiting even when pixel electrodes are closely spaced. The inorganic insulating film provides primary insulation, while the organic insulating film provides additional protection, allowing for reduced pitch without increasing short-circuit risk.

The insulating film layers are deposited beforehand to create protective barriers between closely spaced pixel electrodes. This prior cushioning ensures that even with reduced spacing, any etching residues or Ag remainers cannot cause short-circuits, thus enabling high image definition while maintaining reliability.