Array Substrate Dual-Via Connection for LCD Grayscale Dark Spots

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Solution Overview

Problem

Existing TFT liquid crystal display panels suffer from grayscale dark spots due to breakage or poor quality at the connection points between the ITO film and metal electrode layers, leading to poor connection and display issues.

Innovation Solution

The proposed solution involves an array substrate with a thin film transistor layer, a passivation layer with strategically placed first and second via holes, and a pixel electrode layer connected to the first conductive layer through these via holes, ensuring a robust electrical connection and preventing grayscale dark spots.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single via hole is used to connect the ITO film to the metal electrode layer, then the manufacturing process is simple, but the connection reliability is poor and grayscale dark spots appear

Engineering Contradiction:
Improveconnection reliabilityVSAvoidvia hole structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The single via hole connection structure is segmented into multiple via holes (first via hole and second via hole) arranged in parallel. This segmentation distributes the electrical connection load across multiple pathways, preventing single-point failure and eliminating grayscale dark spots caused by connection breakage, thereby improving connection reliability without significantly complicating the manufacturing process.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the ITO film connection point is made robust, then connection reliability improves, but the manufacturing complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmanufacturing ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Instead of attempting to make a single connection point more robust through material or structural changes, the solution segments the connection into multiple parallel via holes. This approach achieves improved reliability through redundancy rather than through complex manufacturing processes, maintaining ease of manufacture while eliminating connection failures.

Inventive Principle:
Principle #1Segmentation

3Reliability

If multiple via holes are used to connect the pixel electrode to the first conductive layer, then connection reliability improves and grayscale dark spots are prevented, but the passivation layer structure becomes more complex

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidpassivation layer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The passivation layer is segmented to include multiple via holes (first via hole and second via hole) that penetrate through it to establish parallel electrical connections. This segmentation creates redundant connection pathways that prevent grayscale dark spots while maintaining a relatively simple passivation layer structure that can be formed using standard manufacturing processes.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12278242B2Array substrate, display panel, and manufacturing method of array substrate
Publication Date: 2025.04.15 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
  • US12278242B2 patent drawing
  • US12278242B2 patent drawing
  • US12278242B2 patent drawing

AI summary

An array substrate, a display panel, and a manufacturing method of the array substrate are provided, including a thin film transistor layer, a passivation layer, and a pixel electrode layer which are sequentially disposed on one above another. The passivation layer is provided with a first via hole and a second via hole staggered from each other. The pixel electrode layer includes a pixel electrode connected to a first conductive layer through the first via hole and the second via hole. Therefore, a problem of grayscale dark spots caused by the pixel electrode being broken at a connection point with the first conductive layer is avoided.